PIC18F2539-I/SP Microchip Technology, PIC18F2539-I/SP Datasheet - Page 6

IC MCU FLASH 12KX16 EE A/D 28DIP

PIC18F2539-I/SP

Manufacturer Part Number
PIC18F2539-I/SP
Description
IC MCU FLASH 12KX16 EE A/D 28DIP
Manufacturer
Microchip Technology
Series
PIC® 18Fr

Specifications of PIC18F2539-I/SP

Core Size
8-Bit
Program Memory Size
24KB (12K x 16)
Core Processor
PIC
Speed
40MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, LVD, POR, PWM, WDT
Number Of I /o
21
Program Memory Type
FLASH
Eeprom Size
256 x 8
Ram Size
1408 x 8
Voltage - Supply (vcc/vdd)
4.2 V ~ 5.5 V
Data Converters
A/D 5x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
28-DIP (0.300", 7.62mm)
Controller Family/series
PIC18
No. Of I/o's
21
Eeprom Memory Size
256Byte
Ram Memory Size
1.375KB
Cpu Speed
40MHz
No. Of Timers
4
Processor Series
PIC18F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
1408 B
Interface Type
I2C, SPI, AUSART
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
21
Number Of Timers
3
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
DV164005, DV164136
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 5 Channel
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
For Use With
DVA18XP280 - DEVICE ADAPTER 18F2220 PDIP 28LD
Lead Free Status / Rohs Status
 Details
PIC18FXX39
Table of Contents
1.0
2.0
3.0
4.0
5.0
6.0
7.0
8.0
9.0
10.0 Timer0 Module ........................................................................................................................................................................... 99
11.0 Timer1 Module ......................................................................................................................................................................... 103
12.0 Timer2 Module ......................................................................................................................................................................... 107
13.0 Timer3 Module ......................................................................................................................................................................... 109
14.0 Single Phase Induction Motor Control Kernel .......................................................................................................................... 113
15.0 Pulse Width Modulation (PWM) Modules ................................................................................................................................. 123
16.0 Master Synchronous Serial Port (MSSP) Module .................................................................................................................... 125
17.0 Addressable Universal Synchronous Asynchronous Receiver Transmitter (USART).............................................................. 165
18.0 Compatible 10-bit Analog-to-Digital Converter (A/D) Module................................................................................................... 181
19.0 Low Voltage Detect .................................................................................................................................................................. 189
20.0 Special Features of the CPU .................................................................................................................................................... 195
21.0 Instruction Set Summary .......................................................................................................................................................... 211
22.0 Development Support............................................................................................................................................................... 253
23.0 Electrical Characteristics .......................................................................................................................................................... 259
24.0 DC and AC Characteristics Graphs and Tables ....................................................................................................................... 287
25.0 Packaging Information.............................................................................................................................................................. 297
Appendix A: Revision History............................................................................................................................................................. 305
Appendix B: Device Differences......................................................................................................................................................... 305
Appendix C: Conversion Considerations ........................................................................................................................................... 306
Appendix D: Migration from High-End to Enhanced Devices............................................................................................................. 307
Index .................................................................................................................................................................................................. 309
On-Line Support................................................................................................................................................................................. 317
Systems Information and Upgrade Hot Line ...................................................................................................................................... 317
Reader Response .............................................................................................................................................................................. 318
PIC18FXX39 Product Identification System....................................................................................................................................... 319
DS30485A-page 4
Device Overview .......................................................................................................................................................................... 7
Oscillator Configurations ............................................................................................................................................................ 19
Reset .......................................................................................................................................................................................... 23
Memory Organization ................................................................................................................................................................. 33
FLASH Program Memory ........................................................................................................................................................... 51
Data EEPROM Memory ............................................................................................................................................................. 61
8 X 8 Hardware Multiplier ........................................................................................................................................................... 67
Interrupts .................................................................................................................................................................................... 69
I/O Ports ..................................................................................................................................................................................... 83
Preliminary
 2002 Microchip Technology Inc.

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