DSPIC30F5015-30I/PT Microchip Technology, DSPIC30F5015-30I/PT Datasheet - Page 176

• Manufacturer Part Number: DSPIC30F5015-30I/PT
• Description: IC DSPIC MCU/DSP 66K 64TQFP
• Manufacturer: Microchip Technology
• Series: dsPIC™ 30Fr

Specifications of DSPIC30F5015-30I/PT

• Program Memory Type: FLASH
• Program Memory Size: 66KB (22K x 24)
• Package / Case: 64-TFQFP
• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 30 MIPs
• Connectivity: CAN, I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, Motor Control PWM, QEI, POR, PWM, WDT
• Number Of I /o: 52
• Eeprom Size: 1K x 8
• Ram Size: 2K x 8
• Voltage - Supply (vcc/vdd): 2.5 V ~ 5.5 V
• Data Converters: A/D 16x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Product: DSCs
• Data Bus Width: 16 bit
• Processor Series: DSPIC30F
• Core: dsPIC
• Maximum Clock Frequency: 30 MHz
• Number Of Programmable I/os: 52
• Data Ram Size: 2 KB
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52713-733, 52714-737, 53276-922, EWDSPIC
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE4000, DM240002, DM330011
• Minimum Operating Temperature: - 40 C
• Package: 64TQFP
• Device Core: dsPIC
• Family Name: dsPIC30
• Maximum Speed: 30 MHz
• Operating Supply Voltage: 3.3|5 V
• Interface Type: CAN/I2C/SPI/UART
• On-chip Adc: 16-chx10-bit
• Number Of Timers: 5
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: XLT64PT5 - SOCKET TRAN ICE 64MQFP/TQFPAC164319 - MODULE SKT MPLAB PM3 64TQFPAC30F008 - MODULE SKT FOR DSPIC30F 64TQFPDV164005 - KIT ICD2 SIMPLE SUIT W/USB CABLE
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: DSPIC30F501530IPT

dsPIC30F5015/5016
24.1
TABLE 24-1:
TABLE 24-2:
TABLE 24-3:
TABLE 24-4:
DS70149D-page 176
dsPIC30F5015-30I/dsPIC30F5016-30I
dsPIC30F5015-20E/dsPIC30F5016-20E
Power Dissipation:
Internal chip power dissipation:
I/O Pin Power Dissipation:
Maximum Allowed Power Dissipation
Package Thermal Resistance, 80-pin TQFP (12x12x1mm)
Package Thermal Resistance, 64-pin TQFP (10x10x1mm)
Note 1:
V
V
(in Volts)
(in Volts)
DD
DD
Operating Junction Temperature Range
Operating Junction Temperature Range
Operating Ambient Temperature Range
Operating Ambient Temperature Range
DC Characteristics
4.5-5.5
4.5-5.5
3.0-3.6
3.0-3.6
2.5-3.0
4.5-5.5
4.5-5.5
3.0-3.6
3.0-3.6
2.5-3.0
P
P
INT
Junction to ambient thermal resistance, Theta-ja (
Range
Range
I
/
O
=
=
∑
V
OPERATING MIPS VS. VOLTAGE FOR dsPIC30F5015
OPERATING MIPS VS. VOLTAGE FOR dsPIC30F5016
THERMAL PACKAGING CHARACTERISTICS
THERMAL OPERATING CONDITIONS FOR PIC18FXXXX
DD
(
{
×
V
(
DD
I
D D
Characteristic
–
–
V
∑
Rating
OH
} I
I
Temp Range
Temp Range
OH
×
-40 to +125
-40 to +125
-40 to +125
-40 to +125
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
)
OH
(in °C)
(in °C)
)
+
∑
(
V
O L
×
I
O L
)
dsPIC30F5015-30I
dsPIC30F5016-30I
θ
JA
) numbers are achieved by package simulations.
Symbol
Symbol
30
—
20
—
10
30
—
20
—
10
P
DMAX
θ
θ
P
T
T
T
T
JA
JA
A
A
D
J
J
Min
Typ
Max MIPS
Max MIPS
-40
-40
-40
-40
39
39
(T
© 2008 Microchip Technology Inc.
P
J
INT
– T
Max
Typ
—
—
—
—
—
—
dsPIC30F5015-20E
dsPIC30F5016-20E
+ P
A
)/
θ
I
/
O
JA
°C/W
°C/W
+125
+150
+125
20
15
20
15
—
—
—
—
—
—
Max
Unit
+85
Notes
Unit
°C
°C
°C
°C
W
W
1
1