DSPIC30F5015-30I/PT Microchip Technology, DSPIC30F5015-30I/PT Datasheet - Page 183

IC DSPIC MCU/DSP 66K 64TQFP

DSPIC30F5015-30I/PT

Manufacturer Part Number
DSPIC30F5015-30I/PT
Description
IC DSPIC MCU/DSP 66K 64TQFP
Manufacturer
Microchip Technology
Series
dsPIC™ 30Fr

Specifications of DSPIC30F5015-30I/PT

Program Memory Type
FLASH
Program Memory Size
66KB (22K x 24)
Package / Case
64-TFQFP
Core Processor
dsPIC
Core Size
16-Bit
Speed
30 MIPs
Connectivity
CAN, I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, Motor Control PWM, QEI, POR, PWM, WDT
Number Of I /o
52
Eeprom Size
1K x 8
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
2.5 V ~ 5.5 V
Data Converters
A/D 16x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Product
DSCs
Data Bus Width
16 bit
Processor Series
DSPIC30F
Core
dsPIC
Maximum Clock Frequency
30 MHz
Number Of Programmable I/os
52
Data Ram Size
2 KB
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52713-733, 52714-737, 53276-922, EWDSPIC
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE4000, DM240002, DM330011
Minimum Operating Temperature
- 40 C
Package
64TQFP
Device Core
dsPIC
Family Name
dsPIC30
Maximum Speed
30 MHz
Operating Supply Voltage
3.3|5 V
Interface Type
CAN/I2C/SPI/UART
On-chip Adc
16-chx10-bit
Number Of Timers
5
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
XLT64PT5 - SOCKET TRAN ICE 64MQFP/TQFPAC164319 - MODULE SKT MPLAB PM3 64TQFPAC30F008 - MODULE SKT FOR DSPIC30F 64TQFPDV164005 - KIT ICD2 SIMPLE SUIT W/USB CABLE
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
DSPIC30F501530IPT

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DSPIC30F5015-30I/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
Part Number:
DSPIC30F5015-30I/PT
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
Part Number:
DSPIC30F5015-30I/PT
0
TABLE 24-11: ELECTRICAL CHARACTERISTICS: BOR
TABLE 24-12: DC CHARACTERISTICS: PROGRAM AND EEPROM
© 2008 Microchip Technology Inc.
DC CHARACTERISTICS
BO10
BO15
Note 1:
DC CHARACTERISTICS
D120
D121
D122
D123
D124
D130
D131
D132
D133
D134
D135
D136
D137
D138
Note 1:
Param
Param
No.
No.
2:
3:
2:
V
V
Symbol
E
V
T
T
I
E
V
V
V
T
T
T
I
I
Symbol
BOR
BHYS
DEW
PEW
EB
EB
Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and
are not tested.
These parameters are characterized but not tested in manufacturing.
‘11’ values not in usable operating range.
Data in “Typ” column is at 5V, 25°C unless otherwise stated.
These parameters are characterized but not tested in manufacturing.
DEW
RETD
EB
PEW
RETD
D
DRW
P
PR
PEW
BOR Voltage
V
low-to-high
Data EEPROM Memory
Byte Endurance
V
Erase/Write Cycle Time
Characteristic Retention
I
Program FLASH
Memory
Cell Endurance
V
V
V
Erase/Write Cycle Time
Characteristic Retention
ICSP™ Block Erase Time
I
I
DD
DD
DD
DD
DD
DD
DD
DD
During Programming
During Programming
During Programming
transition
for Read/Write
for Read
for Bulk Erase
for Erase/Write
Characteristic
(2)
Characteristic
(2)
on
BORV = 11
BORV = 10
BORV = 01
BORV = 00
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature
(2)
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature
100K
V
V
Min
10K
4.5
3.0
40
40
MIN
MIN
1
(3)
Typ
100K
100
100
1M
10
10
10
2
4
(1)
4.58
Min
2.6
4.1
dsPIC30F5015/5016
Max
5.5
5.5
5.5
5.5
30
30
30
-40°C ≤ T
-40°C ≤ T
2
Typ
5
(1)
-40°C ≤ T
-40°C ≤ T
Units
E/W
Year
Year
E/W
mA
mA
mA
ms
ms
ms
V
V
V
V
A
A
Max
2.71
4.73
≤ +85°C for Industrial
≤ +125°C for Extended
4.4
-40°C ≤ T
Using EECON to read/write
V
voltage
Provided no other specifications
are violated
Row Erase
-40°C ≤ T
V
voltage
Provided no other specifications
are violated
Row Erase
Bulk Erase
A
A
MIN
MIN
≤ +85°C for Industrial
≤ +125°C for Extended
Units
mV
= Minimum operating
= Minimum operating
V
V
V
V
A
A
Conditions
≤ +85°C
≤ +85°C
Not in operating
range
DS70149D-page 183
Conditions

Related parts for DSPIC30F5015-30I/PT