DSPIC30F5015-30I/PT Microchip Technology, DSPIC30F5015-30I/PT Datasheet - Page 7

• Manufacturer Part Number: DSPIC30F5015-30I/PT
• Description: IC DSPIC MCU/DSP 66K 64TQFP
• Manufacturer: Microchip Technology
• Series: dsPIC™ 30Fr

Specifications of DSPIC30F5015-30I/PT

• Program Memory Type: FLASH
• Program Memory Size: 66KB (22K x 24)
• Package / Case: 64-TFQFP
• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 30 MIPs
• Connectivity: CAN, I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, Motor Control PWM, QEI, POR, PWM, WDT
• Number Of I /o: 52
• Eeprom Size: 1K x 8
• Ram Size: 2K x 8
• Voltage - Supply (vcc/vdd): 2.5 V ~ 5.5 V
• Data Converters: A/D 16x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Product: DSCs
• Data Bus Width: 16 bit
• Processor Series: DSPIC30F
• Core: dsPIC
• Maximum Clock Frequency: 30 MHz
• Number Of Programmable I/os: 52
• Data Ram Size: 2 KB
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52713-733, 52714-737, 53276-922, EWDSPIC
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE4000, DM240002, DM330011
• Minimum Operating Temperature: - 40 C
• Package: 64TQFP
• Device Core: dsPIC
• Family Name: dsPIC30
• Maximum Speed: 30 MHz
• Operating Supply Voltage: 3.3|5 V
• Interface Type: CAN/I2C/SPI/UART
• On-chip Adc: 16-chx10-bit
• Number Of Timers: 5
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: XLT64PT5 - SOCKET TRAN ICE 64MQFP/TQFPAC164319 - MODULE SKT MPLAB PM3 64TQFPAC30F008 - MODULE SKT FOR DSPIC30F 64TQFPDV164005 - KIT ICD2 SIMPLE SUIT W/USB CABLE
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: DSPIC30F501530IPT

Table of Contents
1.0
2.0
3.0
4.0
5.0
6.0
7.0
8.0
9.0
10.0 Timer2/3 Module ........................................................................................................................................................................ 71
11.0 Timer4/5 Module ....................................................................................................................................................................... 77
12.0 Input Capture Module ................................................................................................................................................................ 81
13.0 Output Compare Module ............................................................................................................................................................ 85
14.0 Quadrature Encoder Interface (QEI) Module ............................................................................................................................. 89
15.0 Motor Control PWM Module ....................................................................................................................................................... 95
16.0 SPI™ Module ........................................................................................................................................................................... 105
17.0 I2C™ Module ........................................................................................................................................................................... 109
18.0 Universal Asynchronous Receiver Transmitter (UART) Module .............................................................................................. 117
19.0 CAN Module ............................................................................................................................................................................. 125
20.0 System Integration ................................................................................................................................................................... 135
21.0 10-bit High-Speed Analog-to-Digital Converter (ADC) Module ................................................................................................ 151
22.0 Instruction Set Summary .......................................................................................................................................................... 163
23.0 Development Support............................................................................................................................................................... 171
24.0 Electrical Characteristics .......................................................................................................................................................... 175
25.0 Packaging Information.............................................................................................................................................................. 215
Appendix A: ....................................................................................................................................................................................... 219
Index ................................................................................................................................................................................................. 221
The Microchip Web Site ..................................................................................................................................................................... 227
Customer Change Notification Service .............................................................................................................................................. 227
Customer Support .............................................................................................................................................................................. 227
Reader Response .............................................................................................................................................................................. 228
Product Identification System ............................................................................................................................................................ 229
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Device Overview .......................................................................................................................................................................... 9
CPU Architecture Overview........................................................................................................................................................ 17
Memory Organization ................................................................................................................................................................. 25
Address Generator Units............................................................................................................................................................ 37
Interrupts .................................................................................................................................................................................... 43
Flash Program Memory.............................................................................................................................................................. 51
Data EEPROM Memory ............................................................................................................................................................. 57
I/O Ports ..................................................................................................................................................................................... 61
Timer1 Module ........................................................................................................................................................................... 67
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dsPIC30F5015/5016
DS70149D-page 7