ST92F150CV1QB STMicroelectronics, ST92F150CV1QB Datasheet - Page 142

• Manufacturer Part Number: ST92F150CV1QB
• Description: MCU 8BIT 128K FLASH 100PQFP
• Manufacturer: STMicroelectronics
• Series: ST9r

Specifications of ST92F150CV1QB

• Core Processor: ST9
• Core Size: 8/16-Bit
• Speed: 24MHz
• Connectivity: CAN, I²C, LIN, SCI, SPI
• Peripherals: DMA, LVD, POR, PWM, WDT
• Number Of I /o: 77
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• Eeprom Size: 1K x 8
• Ram Size: 4K x 8
• Voltage - Supply (vcc/vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 16x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C
• Package / Case: 100-QFP
• Processor Series: ST92F15x
• Core: ST9
• Data Bus Width: 8 bit, 16 bit
• Data Ram Size: 6 KB
• Interface Type: CAN, I2C, SCI, SPI
• Maximum Clock Frequency: 24 MHz
• Number Of Programmable I/os: 80
• Number Of Timers: 5 x 16 bit
• Operating Supply Voltage: 4.5 V to 5.5 V
• Maximum Operating Temperature: + 105 C
• Mounting Style: SMD/SMT
• Development Tools By Supplier: ST92F150-EPB
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 16 bit x 10 bit
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 497-4882

ST92F124/F150/F250 - EXTERNAL MEMORY INTERFACE (EXTMI)
8 EXTERNAL MEMORY INTERFACE (EXTMI)
8.1 INTRODUCTION
The ST9 External Memory Interface uses two reg-
isters (EMR1 and EMR2) to configure external
memory accesses. Some interface signals are
also affected by WCR - R252 Page 0.
If the two registers EMR1 and EMR2 are set to the
proper values, the ST9+ memory access cycle is
similar to that of the original ST9, with the only ex-
ception that it is composed of just two system
clock phases, named T1 and T2.
During phase T1, the memory address is output on
the AS falling edge and is valid on the rising edge
of AS. Port1 and Port 9 maintain the address sta-
ble until the following T1 phase.
Figure 73. Page 21 Registers
142/429
9
FFh
FEh
FDh
FCh
FBh
FAh
F9h
F8h
F7h
F6h
F5h
F4h
F3h
F2h
F1h
F0h
Page 21
DMASR
ISR
EMR2
EMR1
CSR
DPR3
DPR2
DPR1
DPR0
R255
R254
R253
R252
R251
R250
R249
R248
R247
R246
R245
R244
R243
R242
R241
R240
MMU
EXT.MEM
MMU
MODER
FLAGR
USPH
SSPH
SSPL
USPL
CICR
PPR
RP1
RP0
P5
P4
P3
P2
P1
P0
Bit DPRREM=0
Relocation of P0-3 and DPR0-3 Registers
During phase T2, two forms of behavior are possi-
ble. If the memory access is a Read cycle, Port 0
pins are released in high-impedance until the next
T1 phase and the data signals are sampled by the
ST9 on the rising edge of DS. If the memory ac-
cess is a Write cycle, on the falling edge of DS,
Port 0 outputs data to be written in the external
memory. Those data signals are valid on the rising
edge of DS and are maintained stable until the
next address is output.
Note that DS is pulled low at the beginning of
phase T2 only during an external memory access.
DMASR
EMR2
EMR1
DPR3
DPR2
DPR1
DPR0
CSR
ISR
MODER
FLAGR
SSPH
USPH
USPL
DPR3
DPR2
DPR1
DPR0
SSPL
CICR
PPR
RP1
RP0
P5
P4
Bit DPRREM=1
DMASR
EMR2
EMR1
CSR
ISR
P3
P2
P1
P0