MC9S08JM16CGT Freescale Semiconductor, MC9S08JM16CGT Datasheet - Page 370
![MCU 8BIT 16K FLASH 48-QFN](/photos/37/62/376240/qfn-48_sml.jpg)
MC9S08JM16CGT
Manufacturer Part Number
MC9S08JM16CGT
Description
MCU 8BIT 16K FLASH 48-QFN
Manufacturer
Freescale Semiconductor
Series
HCS08r
Datasheet
1.DEMO9S08JM16.pdf
(386 pages)
Specifications of MC9S08JM16CGT
Core Processor
HCS08
Core Size
8-Bit
Speed
48MHz
Connectivity
I²C, LIN, SCI, SPI, USB
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
37
Program Memory Size
16KB (16K x 8)
Program Memory Type
FLASH
Ram Size
1K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 8x12b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
48-QFN Exposed Pad
Processor Series
S08JM
Core
HCS08
Data Bus Width
8 bit
Data Ram Size
1 KB
Interface Type
I2C, SPI
Maximum Clock Frequency
48 MHz
Number Of Programmable I/os
37
Number Of Timers
2
Operating Supply Voltage
2.7 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWS08
Development Tools By Supplier
DEMOJM, DEMOJMSKT, DEMOFLEXISJMSD, DEMO9S08JM16
Minimum Operating Temperature
- 40 C
On-chip Adc
12 bit, 8 Channel
Controller Family/series
HCS08
No. Of I/o's
37
Ram Memory Size
1KB
Cpu Speed
48MHz
No. Of Timers
2
Digital Ic Case Style
QFN
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MC9S08JM16CGT
Manufacturer:
PIXART
Quantity:
1 001
Part Number:
MC9S08JM16CGT
Manufacturer:
FREESCALE
Quantity:
20 000
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1
Appendix A Electrical Characteristics
If the Freescale S08USBV1 implementation has electrical characteristics that deviate from the standard or
require additional information, this space would be used to communicate that information.
18.5
Electromagnetic compatibility (EMC) performance is highly dependant on the environment in which the
MCU resides. Board design and layout, circuit topology choices, location and characteristics of external
components as well as MCU software operation all play a significant role in EMC performance. The
system designer can consult Freescale applications notes such as AN2321, AN1050, AN1263, AN2764,
and AN1259 for advice and guidance specifically targeted at optimizing EMC performance.
18.5.1
Microcontroller radiated RF emissions are measured from 150 kHz to 1 GHz using the TEM/GTEM Cell
method in accordance with the IEC 61967-2 and SAE J1752/3 standards. The measurement is performed
with the microcontroller installed on a custom EMC evaluation board while running specialized EMC test
software. The radiated emissions from the microcontroller are measured in a TEM cell in two package
orientations (North and East). For more detailed information concerning the evaluation results, conditions
and setup, please refer to the EMC evaluation report for this device.
The maximum radiated RF emissions of the tested configuration in all orientations are less than or equal
to the reported emissions levels.
370
Radiated emissions,
electric field
The reported emission level is the value of the maximum emission, rounded up to the next whole number, from among the
measured orientations in each frequency range.
Regulator operating voltage
VREG output
V
VREG disabled
VREG Quiescent Current
USB33
Parameter
EMC Performance
Radiated Emissions
input with internal
Table A-16. Internal USB 3.3V Voltage Regulator Characteristics
V
Symbol
RE_TEM
MC9S08JM16 Series Data Sheet, Rev. 2
Symbol
V
V
Table 18-8. Radiated Emissions
V
usb33in
I
regout
VRQ
regin
V
Conditions
T
A
DD
= +25
= 5.0 V
o
C
Unit
mA
V
V
V
500 – 1000 MHz
150 – 500 MHz
0.15 – 50 MHz
50 – 150 MHz
Frequency
SAE Level
IEC Level
Min
3.9
—
3
3
4 MHz crystal
20 MHz Bus
f
OSC
/f
Typ
3.3
3.3
0.5
—
BUS
Freescale Semiconductor
Level
(Max)
11
–2
N
7
2
2
Max
5.5
3.6
3.6
—
1
dBμV
Unit
—
—
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