MC9S08JM16CGT Freescale Semiconductor, MC9S08JM16CGT Datasheet - Page 47

• Manufacturer Part Number: MC9S08JM16CGT
• Description: MCU 8BIT 16K FLASH 48-QFN
• Manufacturer: Freescale Semiconductor
• Series: HCS08r

Specifications of MC9S08JM16CGT

• Core Processor: HCS08
• Core Size: 8-Bit
• Speed: 48MHz
• Connectivity: I²C, LIN, SCI, SPI, USB
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 37
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: FLASH
• Ram Size: 1K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 8x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 48-QFN Exposed Pad
• Processor Series: S08JM
• Core: HCS08
• Data Bus Width: 8 bit
• Data Ram Size: 1 KB
• Interface Type: I2C, SPI
• Maximum Clock Frequency: 48 MHz
• Number Of Programmable I/os: 37
• Number Of Timers: 2
• Operating Supply Voltage: 2.7 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWS08
• Development Tools By Supplier: DEMOJM, DEMOJMSKT, DEMOFLEXISJMSD, DEMO9S08JM16
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 12 bit, 8 Channel
• Controller Family/series: HCS08
• No. Of I/o's: 37
• Ram Memory Size: 1KB
• Cpu Speed: 48MHz
• No. Of Timers: 2
• Digital Ic Case Style: QFN
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

LDHX
TXS
When security is enabled, the RAM is considered a secure memory resource and is not accessible through
BDM or through code executing from non-secure memory. See
description of the security feature.
4.4
USB RAM is discussed in detail in
4.5
Flash memory is used for program storage. In-circuit programming allows the operating program to be
loaded into the flash memory after final assembly of the application product. It is possible to program the
entire array through the single-wire background debug interface. Because no special voltages are needed
for flash erase and programming operations, in-application programming is also possible through other
software-controlled communication paths. For a more detailed discussion of in-circuit and in-application
programming, refer to the HCS08 Family Reference Manual, Volume I, Freescale Semiconductor
document order number HCS08RMv1.
4.5.1
Features of the flash memory include:
4.5.2
Before any program or erase command can be accepted, the flash clock divider register (FCDIV) must be
written to set the internal clock for the flash module to a frequency (f
(see
normally this write is done during reset initialization. FCDIV cannot be written if the access error flag,
FACCERR in FSTAT, is set. The user must ensure that FACCERR is not set before writing to the FCDIV
register. One period of the resulting clock (1/f
Freescale Semiconductor
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Section 4.7.1, “Flash Clock Divider Register
Flash size
— MC9S08JM16 — 16, 384 bytes (32 pages of 512 bytes each)
— MC9S08JM8 — 8,192 bytes (16 pages of 512 bytes each)
Single power supply program and erase
Command interface for fast program and erase operation
Up to 100,000 program/erase cycles at typical voltage and temperature
Flexible block protection
Security feature for flash and RAM
Auto power-down for low-frequency read accesses
USB RAM
Flash
#RamLast+1
Features
Program and Erase Times
;point one past RAM
;SP<-(H:X-1)
MC9S08JM16 Series Data Sheet, Rev. 2
Chapter 17, “Universal Serial Bus Device Controller
FCLK
(FCDIV).”) This register can be written only once, so
) is used by the command processor to time program
Section 4.6,
FCLK
) between 150 kHz and 200 kHz
“Security,” for a detailed
(S08USBV1).”
Chapter 4 Memory
47