HD6413008VX25 Renesas Electronics America, HD6413008VX25 Datasheet - Page 519

• Manufacturer Part Number: HD6413008VX25
• Description: MCU 5V 0K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of HD6413008VX25

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: PWM, WDT
• Number Of I /o: 35
• Program Memory Type: ROMless
• Ram Size: 4K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -
• Program Memory Size: -
• Other names: HD6413008VTE25; HD6413008VTE25

Item
Three-state
leakage
current
Input pull-up
MOS current
Input
capacitance
Current
dissipation*
Analog power
supply current
Reference
current
RAM standby voltage
2
Ports 4 to 6,
A
Ports 8 to B
RESO
Ports 4 and 5
NMI
All input pins
except NMI
Normal
operation
Sleep mode
Module
standby mode
Standby mode
During A/D
conversion
During A/D
and D/A
conversion
Idle
During A/D
conversion
During A/D
and D/A
conversion
Idle
0
to A
19
,
Symbol
|I
−I
C
I
AI
AI
V
CC
TSI
RAM
in
p
CC
CC
*
|
3
Min
⎯
⎯
50
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
2.0
Typ
⎯
⎯
⎯
⎯
⎯
32
(5.0 V)
37
(5.0 V)
24
(5.0 V)
29
(5.0 V)
19
(5.0 V)
21
(5.0 V)
1.0
⎯
0.6
0.6
0.01
0.45
2.0
0.01
⎯
Rev.4.00 Aug. 20, 2007 Page 473 of 638
Max
1.0
10.0
300
50
15
47
58
38
47
31
37
10
80
1.5
1.5
5.0
0.8
3.0
5.0
⎯
19. Electrical Characteristics
Unit
μA
μA
μA
pF
pF
mA
mA
mA
mA
mA
mA
μA
μA
mA
mA
μA
mA
mA
μA
V
REJ09B0395-0400
Test
Conditions
V
V
V
V
Vin = 0 V
f = fmin
Ta = 25°C
f = 20 MHz
f = 25 MHz
f = 20 MHz
f = 25 MHz
f = 20 MHz
f = 25 MHz
T
50°C < T
DASTE = 0
DASTE = 0
a
in
CC
in
in
≤ 50°C
= 0.5 V to
= 0 V
= 0 V
−0.5 V
a