MC68HC908GP32CP Freescale Semiconductor, MC68HC908GP32CP Datasheet - Page 395

IC MCU 8MHZ 32K FLASH 40-DIP

MC68HC908GP32CP

Manufacturer Part Number
MC68HC908GP32CP
Description
IC MCU 8MHZ 32K FLASH 40-DIP
Manufacturer
Freescale Semiconductor
Series
HC08r
Datasheet

Specifications of MC68HC908GP32CP

Core Processor
HC08
Core Size
8-Bit
Speed
8MHz
Connectivity
SCI, SPI
Peripherals
LVD, POR, PWM
Number Of I /o
33
Program Memory Size
32KB (32K x 8)
Program Memory Type
FLASH
Ram Size
512 x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 8x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
40-DIP (0.600", 15.24mm)
For Use With
M68EVB908GP32 - BOARD EVALUATION FOR HC908GP32
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MC68HC908GP32CP
Manufacturer:
ROCKWELL
Quantity:
201
Part Number:
MC68HC908GP32CP
Manufacturer:
MOTOROLA/摩托罗拉
Quantity:
20 000
24.5 44-Pin Plastic Quad Flat Pack (QFP)
MC68HC908GP32
MOTOROLA
SEATING
PLANE
–C–
DATUM
PLANE
–A–
C
E
–H–
H
44
34
MC68HC08GP32
33
1
G
0.20 (0.008)
0.05 (0.002) A–B
0.20 (0.008)
DETAIL C
–D–
W
A
M
M
S
L
X
DETAIL A
C
H
K
A–B
A–B
M
Rev. 6
S
S
R
T
Mechanical Specifications
D
D
M
Q
S
S
23
11
12
22
M
DETAIL C
–H–
–B–
DATUM
PLANE
0.01 (0.004)
44-Pin Plastic Quad Flat Pack (QFP)
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE –H– IS LOCATED AT BOTTOM OF
4. DATUMS –A–, –B– AND –D– TO BE DETERMINED AT
5. DIMENSIONS S AND V TO BE DETERMINED AT
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
7. DIMENSION D DOES NOT INCLUDE DAMBAR
Y14.5M, 1982.
LEAD AND IS COINCIDENT WITH THE LEAD WHERE
THE LEAD EXITS THE PLASTIC BODY AT THE
BOTTOM OF THE PARTING LINE.
DATUM PLANE –H–.
SEATING PLANE –C–.
PROTRUSION. ALLOWABLE PROTRUSION IS 0.25
(0.010) PER SIDE. DIMENSIONS A AND B DO
INCLUDE MOLD MISMATCH AND ARE DETERMINED
AT DATUM PLANE –H–.
PROTRUSION. ALLOWABLE DAMBAR PROTRUSION
SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE D
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT.
0.20 (0.008)
DIM
W
A
B
C
D
E
G
H
K
M
N
Q
R
S
U
V
X
F
J
L
T
J
SECTION B–B
DETAIL A
12.95
12.95
MILLIMETERS
MIN
9.90
9.90
2.10
0.30
2.00
0.30
0.13
0.65
0.13
0.13
0.13
0.40
Mechanical Specifications
0.80 BSC
8.00 REF
1.6 REF
B
B
–A–, –B–, –D–
F
D
M
10.10
10.10
13.45
13.45
MAX
10°
2.45
0.45
2.10
0.40
0.25
0.23
0.95
0.17
0.30
C
A–B
0.390
0.390
0.083
0.012
0.079
0.012
0.005
0.026
0.005
0.005
0.510
0.005
0.510
0.016
MIN
0.031 BSC
0.315 REF
0.063 REF
INCHES
Technical Data
N
BASE METAL
S
0.398
0.398
0.096
0.018
0.083
0.016
0.010
0.009
0.037
0.007
0.012
0.530
0.530
MAX
D
10°
S
393

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