S9S12XS128J1MAL Freescale Semiconductor, S9S12XS128J1MAL Datasheet - Page 665

• Manufacturer Part Number: S9S12XS128J1MAL
• Description: IC MCU 16BIT 128KB FLSH 112LQFP
• Manufacturer: Freescale Semiconductor
• Series: HCS12r

Specifications of S9S12XS128J1MAL

• Core Processor: HCS12X
• Core Size: 16-Bit
• Speed: 40MHz
• Connectivity: CAN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 91
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• Eeprom Size: 8K x 8
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 1.72 V ~ 5.5 V
• Data Converters: A/D 16x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 112-LQFP
• Processor Series: S12XS
• Core: HCS12
• Data Bus Width: 16 bit
• Data Ram Size: 8 KB
• Interface Type: CAN, SCI, SPI
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 91
• Number Of Timers: 12
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWHCS12
• Development Tools By Supplier: DEMO9S12XSFAME, EVB9S12XEP100
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 12 bit, 16 Channel
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

1
2
3
4
5
Freescale Semiconductor
Num
10
11
12
13
14
15
The values for thermal resistance are achieved by package simulations
Junction to ambient thermal resistance, θ
horizontal configuration in natural convection.
Junction to ambient thermal resistance, θ
horizontal configuration in natural convection.
Junction to case thermal resistance was simulated to be equivalent to the measured values using the cold plate technique with
the cold plate temperature used as the “case” temperature. This basic cold plate measurement technique is described by MIL-
STD 883D, Method 1012.1. This is the correct thermal metric to use to calculate thermal performance when the package is
being used with a heat sink.
Thermal characterization parameter Ψ
case as defined in JESD51-2. Ψ
enviroment.
1
2
3
4
5
6
7
8
9
C
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
Thermal resistance LQFP 112, single sided PCB
Thermal resistance LQFP 112, double sided PCB
with 2 internal planes
Junction to Board LQFP 112
Junction to Case LQFP 112
Junction to Package Top LQFP 112
Thermal resistance QFP 80, single sided PCB
Thermal resistance QFP 80, double sided PCB
with 2 internal planes
Junction to Board QFP 80
Junction to Case QFP 80
Junction to Package Top QFP 80
Thermal resistance LQFP 64, single sided PCB
Thermal resistance LQFP 64, double sided PCB
with 2 internal planes
Junction to Board LQFP 64
Junction to Case LQFP 64
Junction to Package Top LQFP 64
Table A-6. Thermal Package Characteristics (9S12XS128)
3
3
3
JT
Rating
is a useful value to use to estimate junction temperature in a steady state customer
4
4
JT
S12XS Family Reference Manual, Rev. 1.11
4
is the “resistance” from junction to reference point thermocouple on top center of the
JA
JA
5
was simulated to be equivalent to the JEDEC specification JESD51-2 in a
was simulated to be equivalent to the JEDEC specification JESD51-7 in a
5
5
LQFP 112
LQFP 64
QFP 80
2
2
2
Symbol
Ψ
Ψ
Ψ
θ
θ
θ
θ
θ
θ
θ
θ
θ
θ
θ
θ
JC
JC
JC
JA
JA
JB
JA
JA
JB
JA
JA
JB
JT
JT
JT
Min
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
1
Typ
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
Electrical Characteristics
Max
58
48
36
14
56
43
28
19
64
46
28
13
2
5
2
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
665