LPC1342FBD48,151 NXP Semiconductors, LPC1342FBD48,151 Datasheet - Page 52

IC MCU 32BIT 48LQFP

LPC1342FBD48,151

Manufacturer Part Number
LPC1342FBD48,151
Description
IC MCU 32BIT 48LQFP
Manufacturer
NXP Semiconductors
Series
LPC13xxr
Datasheet

Specifications of LPC1342FBD48,151

Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
72MHz
Connectivity
I²C, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals
Brown-out Detect/Reset, POR, WDT
Number Of I /o
40
Program Memory Size
16KB (16K x 8)
Program Memory Type
FLASH
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 3.6 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
48-LQFP
Processor Series
LPC1342
Core
ARM Cortex-M3
Data Bus Width
32 bit
Data Ram Size
4 KB
Interface Type
I2C, USB, UART
Maximum Clock Frequency
72 MHz
Number Of Programmable I/os
42
Number Of Timers
4
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
 Details
Other names
568-5214

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
LPC1342FBD48,151
Manufacturer:
TI
Quantity:
115
Part Number:
LPC1342FBD48,151
Manufacturer:
NXP Semiconductors
Quantity:
10 000
NXP Semiconductors
LPC1311_13_42_43
Product data sheet
11.3 XTAL Printed-Circuit Board (PCB) layout guidelines
Table 19.
Table 20.
The crystal should be connected on the PCB as close as possible to the oscillator input
and output pins of the chip. Take care that the load capacitors C
third overtone crystal usage have a common ground plane. The external components
must also be connected to the ground plain. Loops must be made as small as possible in
order to keep the noise coupled in via the PCB as small as possible. Also parasitics
should stay as small as possible. Values of C
accordingly to the increase in parasitics of the PCB layout.
Fundamental oscillation
frequency F
1 MHz - 5 MHz
Fundamental oscillation
frequency F
15 MHz - 20 MHz
5 MHz - 10 MHz
10 MHz - 15 MHz
15 MHz - 20 MHz
20 MHz - 25 MHz
Recommended values for C
components parameters) low frequency mode
Recommended values for C
components parameters) high frequency mode
OSC
OSC
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 10 August 2010
Crystal load
capacitance C
10 pF
20 pF
30 pF
10 pF
20 pF
30 pF
10 pF
20 pF
10 pF
Crystal load
capacitance C
10 pF
20 pF
10 pF
20 pF
X1
X1
/C
/C
L
L
X2
X2
in oscillation mode (crystal and external
in oscillation mode (crystal and external
Maximum crystal
series resistance R
< 300 Ω
< 300 Ω
< 300 Ω
< 300 Ω
< 200 Ω
< 100 Ω
< 160 Ω
< 60 Ω
< 80 Ω
Maximum crystal
series resistance R
< 180 Ω
< 100 Ω
< 160 Ω
< 80 Ω
x1
and C
32-bit ARM Cortex-M3 microcontroller
LPC1311/13/42/43
x2
should be chosen smaller
x1
S
S
, C
x2
External load
capacitors C
18 pF, 18 pF
39 pF, 39 pF
57 pF, 57 pF
18 pF, 18 pF
39 pF, 39 pF
57 pF, 57 pF
18 pF, 18 pF
39 pF, 39 pF
18 pF, 18 pF
External load
capacitors C
18 pF, 18 pF
39 pF, 39 pF
18 pF, 18 pF
39 pF, 39 pF
, and C
© NXP B.V. 2010. All rights reserved.
x3
in case of
X1
X1
, C
, C
52 of 62
X2
X2

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