DSPIC30F2010-30I/SPG Microchip Technology, DSPIC30F2010-30I/SPG Datasheet - Page 228

• Manufacturer Part Number: DSPIC30F2010-30I/SPG
• Description: 16BIT 30MIPS DSPIC, 30F2010, DIP28
• Manufacturer: Microchip Technology
• Series: DsPIC30Fr

Specifications of DSPIC30F2010-30I/SPG

• Core Frequency: 30MHz
• Embedded Interface Type: I2C, SPI, UART
• No. Of I/o's: 20
• Flash Memory Size: 12KB
• Supply Voltage Range: 2.5V To 5.5V
• Operating Temperature Range: -40°C To
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

dsPIC30F
40-Lead Plastic Dual In-line (P) – 600 mil Body (PDIP)
DS70082E-page 226
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MO-011
Drawing No. C04-016
n
β
eB
E1
E
Dimension Limits
2
1
D
§
c
Units
A2
eB
A1
E1
B1
A
E
D
B
n
p
L
c
α
A
β
A1
Advance Information
MIN
2.045
.160
.140
.015
.595
.530
.120
.008
.030
.014
.620
5
5
INCHES*
NOM
2.058
.100
.175
.150
.600
.545
.130
.012
.050
.018
.650
40
10
10
MAX
2.065
.190
.160
.625
.560
.135
.015
.070
.022
.680
B
B1
15
15
MIN
13.46
51.94
15.75
15.11
4.06
3.56
0.38
3.05
0.20
0.76
0.36
5
5
MILLIMETERS
 2004 Microchip Technology Inc.
NOM
15.24
13.84
52.26
16.51
4.45
2.54
3.30
0.29
1.27
0.46
3.81
40
10
10
p
α
MAX
A2
15.88
14.22
52.45
17.27
4.83
4.06
3.43
0.38
1.78
0.56
L
15
15