DSPIC30F2010-30I/SPG Microchip Technology, DSPIC30F2010-30I/SPG Datasheet - Page 231

• Manufacturer Part Number: DSPIC30F2010-30I/SPG
• Description: 16BIT 30MIPS DSPIC, 30F2010, DIP28
• Manufacturer: Microchip Technology
• Series: DsPIC30Fr

Specifications of DSPIC30F2010-30I/SPG

• Core Frequency: 30MHz
• Embedded Interface Type: I2C, SPI, UART
• No. Of I/o's: 20
• Flash Memory Size: 12KB
• Supply Voltage Range: 2.5V To 5.5V
• Operating Temperature Range: -40°C To
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

64-Lead Plastic Thin Quad Flatpack (PT) 14x14x1 mm Body, 1.0/0.10 mm Lead Form (TQFP)
 2004 Microchip Technology Inc.
B
c
Number of Pins
Pitch
Pins per Side
Overall Height
Molded Package Thickness
Standoff
Foot Length
Footprint
Foot Angle
Overall Width
Overall Length
Molded Package Width
Molded Package Length
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
JEDEC Equivalent: MS-026
Drawing No. C04-066
β
*Controlling Parameter
Notes:
p
Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed .010" (0.254mm) per side.
Dimension Limits
#leads=n1
E1
E
Units
n1
A2
E1
D1
A1
(F)
α
D
B
β
n
p
A
φ
c
L
E
Advance Information
n
MIN
.037
.002
.018
.004
.012
11
11
2
1
φ
0
INCHES
D1
L
.039 REF
.630 BSC
.630 BSC
.551 BSC
.551 BSC
NOM
.031
64
16
D
.024
.039
.015
3.5
12
12
A
A1
MAX
.047
.006
.030
.008
.018
.041
13
13
(F)
7
MIN
0.95
0.05
0.45
0.09
0.30
11
11
0
MILLIMETERS*
16.00 BSC
16.00 BSC
14.00 BSC
14.00 BSC
1.00 REF
NOM
0.80
dsPIC30F
16
64
1.00
0.60
0.37
3.5
12
12
DS70082E-page 229
MAX
A2
1.20
1.05
0.15
0.75
0.20
0.45
13
13
7
α