DSPIC30F2010-30I/SPG Microchip Technology, DSPIC30F2010-30I/SPG Datasheet - Page 229

• Manufacturer Part Number: DSPIC30F2010-30I/SPG
• Description: 16BIT 30MIPS DSPIC, 30F2010, DIP28
• Manufacturer: Microchip Technology
• Series: DsPIC30Fr

Specifications of DSPIC30F2010-30I/SPG

• Core Frequency: 30MHz
• Embedded Interface Type: I2C, SPI, UART
• No. Of I/o's: 20
• Flash Memory Size: 12KB
• Supply Voltage Range: 2.5V To 5.5V
• Operating Temperature Range: -40°C To
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

44-Lead Plastic Thin Quad Flatpack (PT) 10x10x1 mm Body, 1.0/0.10 mm Lead Form (TQFP)
 2004 Microchip Technology Inc.
Number of Pins
Pitch
Pins per Side
Overall Height
Molded Package Thickness
Standoff §
Foot Length
Footprint (Reference)
Foot Angle
Overall Width
Overall Length
Molded Package Width
Molded Package Length
Lead Thickness
Lead Width
Pin 1 Corner Chamfer
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-026
Drawing No. C04-076
B
c
β
p
#leads=n1
Dimension Limits
E1
E
Units
CH
A2
(F)
D1
n1
A1
E1
A
E
D
B
n
p
L
φ
c
α
β
Advance Information
n
MIN
2
1
.039
.037
.002
.018
.463
.463
.390
.390
.004
.012
.025
φ
D1
0
5
5
L
CH x 45 °
INCHES
D
NOM
A1
.043
.039
.004
.024
.039
.472
.472
.394
.394
.006
.015
.035
.031
3.5
44
10
10
11
A
MAX
.047
.006
.030
.482
.482
.398
.398
.008
.017
.045
.041
15
15
7
(F)
MIN
11.75
11.75
1.00
0.95
0.05
0.45
1.00
9.90
9.90
0.09
0.30
0.64
MILLIMETERS*
0
5
5
NOM
12.00
12.00
10.00
10.00
0.80
1.10
1.00
0.10
0.60
0.15
0.38
0.89
dsPIC30F
3.5
44
10
10
11
A2
DS70082E-page 227
MAX
α
12.25
12.25
10.10
10.10
1.05
0.15
0.75
0.44
1.14
1.20
0.20
15
15
7