PIC24FJ256GA106-I/MR Microchip Technology, PIC24FJ256GA106-I/MR Datasheet - Page 56

IC, 16BIT MCU, PIC24F, 32MHZ, QFN-64

PIC24FJ256GA106-I/MR

Manufacturer Part Number
PIC24FJ256GA106-I/MR
Description
IC, 16BIT MCU, PIC24F, 32MHZ, QFN-64
Manufacturer
Microchip Technology
Series
PIC® 24Fr

Specifications of PIC24FJ256GA106-I/MR

Controller Family/series
PIC24
No. Of I/o's
53
Ram Memory Size
16KB
Cpu Speed
32MHz
No. Of Timers
5
Core Size
16 Bit
Program Memory Size
256KB
Peripherals
ADC, Comparator, PWM, RTC, Timer
Core Processor
PIC
Speed
32MHz
Connectivity
I²C, PMP, SPI, UART/USART
Number Of I /o
53
Program Memory Type
FLASH
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 3.6 V
Data Converters
A/D 16x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
64-VFQFN, Exposed Pad
Processor Series
PIC24FJ
Core
PIC
Data Bus Width
16 bit
Data Ram Size
16 KB
Interface Type
I2C, SPI, UART
Maximum Clock Frequency
32 MHz
Number Of Programmable I/os
52
Number Of Timers
5
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52713-733, 52714-737, 53276-922, EWDSPIC
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, DM240001, DM240011
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 16 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
876-1004 - PIC24 BREAKOUT BOARD
Eeprom Size
-
Lead Free Status / Rohs Status
 Details
PIC24FJXXXDA1/DA2/GB2/GA3
7.0
DS39970B-page 56
Standard Operating Conditions
Operating Temperature: 0C to +70C. Programming at +25C is recommended.
D111
D112
D113
D031
D041
D080
D090
D012
D013
P1
P1A
P1B
P2
P3
P4
P4A
P5
P6
P7
P8
P9
P10
P11
P12
P13
P14
P15
P16
P17
P18
P19
P20
P21
Note 1:
Param
No.
V
I
I
V
V
V
V
C
C
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
AC/DC CHARACTERISTICS AND TIMING REQUIREMENTS
PP
DDP
SET
SET
Symbol
OL
OH
PGEC
PGECL
PGECH
HLD
DLY
DLY
DLY
HLD
DLY
DLY
DLY
DLY
DLY
DLY
R
VALID
DLY
HLD
KEY
KEY
DLY
DLY
DD
IL
IH
IO
F
V
of V
V
DD
CAP
1
2
1
1
2
3
4
6
7
8
9
10
11
12
1
2
3
1
2
A
DD
must also be supplied to the AV
is 1.8V.
and V
Supply Voltage During Programming
Programming Current on MCLR
Supply Current During Programming
Input Low Voltage
Input High Voltage
Output Low Voltage
Output High Voltage
Capacitive Loading on I/O pin (PGEDx)
Filter Capacitor Value on V
Serial Clock (PGECx) Period
Serial Clock (PGECx) Low Time
Serial Clock (PGECx) High Time
Input Data Setup Time to Serial Clock 
Input Data Hold Time from PGECx
Delay Between 4-Bit Command and
Command Operand
Delay Between 4-Bit Command Operand
and Next 4-Bit Command
Delay Between Last PGECx  of Command
Byte to First PGECx  of Read of Data Word
V
Input Data Hold Time from MCLR 
Delay Between Last PGECx  of Command
Byte to PGEDx  by Programming Executive
Programming Executive Command
Processing Time
PGECx Low Time After Programming
Chip Erase Time
Page Erase Time
Row Programming Time
MCLR Rise Time to Enter ICSP mode
Data Out Valid from PGECx 
Delay Between Last PGECx  and MCLR 
MCLR to V
Delay from First MCLR to First PGECx 
for Key Sequence on PGEDx
Delay from Last PGECx for Key Sequence
on PGEDx to Second MCLR 
Delay Between PGEDx  by Programming
Executive to PGEDx Driven by Host
Delay Between Programming Executive
Command Response Words
DD
SS
Setup Time to MCLR 
, respectively. When the internal voltage regulator is enabled (i.e., ENVREG = V
DD
Characteristic
DD
CAP
pins during programming. AV
0.8 V
2.20
Min
V
100
250
100
100
100
400
100
3.0
4.7
1.5
40
40
15
15
40
40
20
25
12
40
20
20
10
40
23
0
1
8
SS
DD
0.2 V
DD
Max
3.60
V
0.4
1.0
16
50
10
40
40
5
DD
and AV
DD
Units
mA
ms
ms
ms
ms
ms
A
pF
F
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
s
s
ns
s
ns
ns
ns
µs
ns
SS
V
V
V
V
V
s
 2010 Microchip Technology Inc.
should always be within ±0.3V
Normal programming
I
I
To meet AC specifications
Required for controller core
ICSP™ mode
Enhanced ICSP mode
ICSP mode
Enhanced ICSP mode
ICSP mode
Enhanced ICSP mode
OL
OH
= 8.5 mA @ 3.6V
= -3.0 mA @ 3.6V
Conditions
DD
), the nominal
(1)

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