CH80566EE025DW S LGPN Intel, CH80566EE025DW S LGPN Datasheet - Page 3

• Manufacturer Part Number: CH80566EE025DW S LGPN
• Description: MPU, ATOM PROCESSOR, Z530P, U-FCBGA8
• Manufacturer: Intel
• Series: ATOM - Z5xxr

Specifications of CH80566EE025DW S LGPN

• Core Size: 32bit
• Program Memory Size: 512KB
• Cpu Speed: 533MHz
• Digital Ic Case Style: FCBGA
• No. Of Pins: 437
• Supply Voltage Range: 0.8V To 1.1V
• Operating Temperature Range: 0°C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Contents
1
2
3
4
5
Datasheet
Introduction ...................................................................................................... 7
1.1
1.2
1.3
1.4
Low Power Features .......................................................................................... 13
2.1
2.2
2.3
2.4
2.5
2.6
Electrical Specifications ..................................................................................... 27
3.1
3.2
3.3
3.4
3.5
3.6
3.7
3.8
3.9
3.10
3.11
3.12
3.13
Package Mechanical Specifications and Pin Information.......................................... 47
4.1
4.2
4.3
Thermal Specifications and Design Considerations ................................................ 65
5.1
Abstract ................................................................................................. 7
Major Features ....................................................................................... 7
Terminology ........................................................................................... 9
References ............................................................................................ 11
Clock Control and Low-Power States ........................................................ 13
Dynamic Cache Sizing ............................................................................ 22
Enhanced Intel SpeedStep® Technology ................................................... 23
Enhanced Low-Power States .................................................................... 24
FSB Low Power Enhancements................................................................. 25
Intel® Burst Performance Technology (Intel® BPT) .................................. 26
FSB, GTLREF, and CMREF ........................................................................ 27
Power and Ground Pins ........................................................................... 27
Decoupling Guidelines ............................................................................ 28
FSB Clock (BCLK[1:0]) and Processor Clocking .......................................... 28
Voltage Identification and Power Sequencing ............................................. 28
Catastrophic Thermal Protection .............................................................. 31
Reserved and Unused Pins ...................................................................... 31
FSB Frequency Select Signals (BSEL[2:0]) ................................................ 31
FSB Signal Groups ................................................................................. 31
CMOS Asynchronous Signals ................................................................... 33
Maximum Ratings .................................................................................. 33
Processor DC Specifications ..................................................................... 34
AGTL+ FSB Specifications ....................................................................... 45
Package Mechanical Specifications ........................................................... 47
Processor Pinout Assignment ................................................................... 49
Signal Description .................................................................................. 56
Thermal Specifications ............................................................................ 68
2.1.1
2.5.1
3.3.1
3.3.2
4.1.1
5.1.1
5.1.2
5.1.3
Package/Core Low-Power State Descriptions ................................ 15
CMOS Front Side Bus ................................................................ 25
V
FSB AGTL+ Decoupling .............................................................. 28
Processor Package Weight ......................................................... 47
Thermal Diode ......................................................................... 68
Intel® Thermal Monitor ............................................................. 70
Digital Thermal Sensor .............................................................. 72
CC
Decoupling ......................................................................... 28
3