DSPIC33FJ256GP710A-H/PT Microchip Technology, DSPIC33FJ256GP710A-H/PT Datasheet - Page 268
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DSPIC33FJ256GP710A-H/PT
Manufacturer Part Number
DSPIC33FJ256GP710A-H/PT
Description
16 Bit MCU/DSP 100LD 40MIPS 256KB FLASH 100 TQFP 12x12x1mm TRAY
Manufacturer
Microchip Technology
Series
dsPIC™ 33Fr
Datasheet
1.DSPIC33FJ64GP206A-IMR.pdf
(338 pages)
Specifications of DSPIC33FJ256GP710A-H/PT
Core Processor
dsPIC
Core Size
16-Bit
Speed
40 MIPs
Connectivity
CAN, I²C, IrDA, LIN, SPI, UART/USART
Peripherals
AC'97, Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Number Of I /o
85
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
30K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 32x10b/12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 140°C
Package / Case
100-TQFP
Processor Series
dsPIC33F
Core
dsPIC
Data Bus Width
16 bit
Interface Type
SPI, I2C, UART, JTAG
Number Of Programmable I/os
35
Operating Supply Voltage
3.3 V
Maximum Operating Temperature
+ 140 C
Mounting Style
SMD/SMT
Development Tools By Supplier
MPLAB IDE Software
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 13 Channel
A/d Bit Size
10 bit
A/d Channels Available
13
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Details
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DSPIC33FJ256GP710A-H/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
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dsPIC33FJXXXGPX06A/X08A/X10A
25.1
TABLE 25-1:
TABLE 25-2:
TABLE 25-3:
DS70593B-page 268
DC5
dsPIC33FJXXXGPX06A/X08A/X10A
Extended Temperature Devices
Power Dissipation:
Internal chip power dissipation:
I/O Pin Power Dissipation:
Maximum Allowed Power Dissipation
Package Thermal Resistance, 100-pin TQFP (14x14x1 mm)
Package Thermal Resistance, 100-pin TQFP (12x12x1 mm)
Package Thermal Resistance, 80-pin TQFP (12x12x1 mm)
Package Thermal Resistance, 64-pin TQFP (10x10x1 mm)
Package Thermal Resistance, 64-pin QFN (9x9x0.9 mm)
Note 1:
Characteristic
Operating Junction Temperature Range
DC Characteristics
P
I/O = ({V
Operating Ambient Temperature Range
Operating Junction Temperature Range
Operating Ambient Temperature Range
INT
Junction to ambient thermal resistance, Theta-
= V
DD
OPERATING MIPS VS. VOLTAGE
THERMAL OPERATING CONDITIONS
THERMAL PACKAGING CHARACTERISTICS
DD
x (I
- V
V
DD
(in Volts)
DD
3.0-3.6V
3.0-3.6V
OH
Characteristic
- I
Range
} x I
Rating
OH
OH
)
) + (V
OL
x I
OL
)
-40°C to +125°C
Preliminary
-40°C to +85°C
Temp Range
(in °C)
JA
(
JA
) numbers are achieved by package simulations.
Symbol
Symbol
P
DMAX
P
T
T
T
T
JA
JA
JA
JA
JA
A
A
D
J
J
dsPIC33FJXXXGPX06A/X08A/X10A
Min
Typ
-40
-40
-40
-40
40
40
40
40
28
(T
2009 Microchip Technology Inc.
P
INT
J
- T
Max
Typ
Max MIPS
—
—
—
—
—
—
—
—
—
+ P
A
)/
40
40
I
/
JA
O
°C/W
°C/W
°C/W
°C/W
°C/W
+125
+140
+125
Max
Unit
+85
Notes
Unit
°C
°C
°C
°C
W
W
1
1
1
1
1
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