DSPIC33FJ256GP710A-H/PT Microchip Technology, DSPIC33FJ256GP710A-H/PT Datasheet - Page 312
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DSPIC33FJ256GP710A-H/PT
Manufacturer Part Number
DSPIC33FJ256GP710A-H/PT
Description
16 Bit MCU/DSP 100LD 40MIPS 256KB FLASH 100 TQFP 12x12x1mm TRAY
Manufacturer
Microchip Technology
Series
dsPIC™ 33Fr
Datasheet
1.DSPIC33FJ64GP206A-IMR.pdf
(338 pages)
Specifications of DSPIC33FJ256GP710A-H/PT
Core Processor
dsPIC
Core Size
16-Bit
Speed
40 MIPs
Connectivity
CAN, I²C, IrDA, LIN, SPI, UART/USART
Peripherals
AC'97, Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Number Of I /o
85
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
30K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 32x10b/12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 140°C
Package / Case
100-TQFP
Processor Series
dsPIC33F
Core
dsPIC
Data Bus Width
16 bit
Interface Type
SPI, I2C, UART, JTAG
Number Of Programmable I/os
35
Operating Supply Voltage
3.3 V
Maximum Operating Temperature
+ 140 C
Mounting Style
SMD/SMT
Development Tools By Supplier
MPLAB IDE Software
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 13 Channel
A/d Bit Size
10 bit
A/d Channels Available
13
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Details
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DSPIC33FJ256GP710A-H/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
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dsPIC33FJXXXGPX06A/X08A/X10A
TABLE 26-12: SPIx MODULE SLAVE MODE (CKE = 0) TIMING REQUIREMENTS
TABLE 26-13: SPIx MODULE SLAVE MODE (CKE = 1) TIMING REQUIREMENTS
DS70593B-page 312
HSP35
HSP40
HSP41
HSP51
HSP60
Note 1:
CHARACTERISTICS
HSP35
HSP40
HSP41
HSP51
Note 1:
CHARACTERISTICS
Param
Param
No.
No.
2:
2:
AC
TscH2doV,
TscL2doV
TdiV2scH,
TdiV2scL
TscH2diL,
TscL2diL
TssH2doZ
AC
These parameters are characterized but not tested in manufacturing.
Assumes 50 pF load on all SPIx pins.
These parameters are characterized but not tested in manufacturing.
Assumes 50 pF load on all SPIx pins.
TscH2doV,
TscL2doV
TdiV2scH,
TdiV2scL
TscH2diL,
TscL2diL
TssH2doZ SSx to SDO
TssL2doV
Symbol
Symbol
SDOx Data Output Valid after
SCKx Edge
Setup Time of SDIx Data Input
to SCKx Edge
Hold Time of SDIx Data Input to
SCKx Edge
SSx to SDOx Output
High-Impedance
Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated)
Operating temperature
SDOx Data Output Valid after
SCKx Edge
Setup Time of SDIx Data Input
to SCKx Edge
Hold Time of SDIx Data Input
to SCKx Edge
High-Impedance
SDOx Data Output Valid after
SSx Edge
Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated)
Operating temperature
Characteristic
Characteristic
X
Output
(1)
(1)
-40°C T
-40°C T
Preliminary
A
Min
Min
A
—
25
25
15
25
25
15
—
—
+140°C for High Temperature
+140°C for High Temperature
Typ
Typ
—
—
—
—
—
—
—
—
—
Max
Max
35
—
—
55
35
55
55
—
—
Units
Units
ns
ns
ns
ns
ns
ns
ns
ns
ns
2009 Microchip Technology Inc.
See Note 2
See Note 2
Conditions
Conditions
—
—
—
—
—
—
—
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