DSPIC33FJ256GP710A-H/PT Microchip Technology, DSPIC33FJ256GP710A-H/PT Datasheet - Page 288
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DSPIC33FJ256GP710A-H/PT
Manufacturer Part Number
DSPIC33FJ256GP710A-H/PT
Description
16 Bit MCU/DSP 100LD 40MIPS 256KB FLASH 100 TQFP 12x12x1mm TRAY
Manufacturer
Microchip Technology
Series
dsPIC™ 33Fr
Datasheet
1.DSPIC33FJ64GP206A-IMR.pdf
(338 pages)
Specifications of DSPIC33FJ256GP710A-H/PT
Core Processor
dsPIC
Core Size
16-Bit
Speed
40 MIPs
Connectivity
CAN, I²C, IrDA, LIN, SPI, UART/USART
Peripherals
AC'97, Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Number Of I /o
85
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
30K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 32x10b/12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 140°C
Package / Case
100-TQFP
Processor Series
dsPIC33F
Core
dsPIC
Data Bus Width
16 bit
Interface Type
SPI, I2C, UART, JTAG
Number Of Programmable I/os
35
Operating Supply Voltage
3.3 V
Maximum Operating Temperature
+ 140 C
Mounting Style
SMD/SMT
Development Tools By Supplier
MPLAB IDE Software
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 13 Channel
A/d Bit Size
10 bit
A/d Channels Available
13
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Details
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DSPIC33FJ256GP710A-H/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
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dsPIC33FJXXXGPX06A/X08A/X10A
FIGURE 25-11:
TABLE 25-30: SPIx MODULE SLAVE MODE (CKE = 0) TIMING REQUIREMENTS
DS70593B-page 288
AC CHARACTERISTICS
SP70
SP71
SP72
SP73
SP30
SP31
SP35
SP40
SP41
SP50
SP51
SP52
Note 1:
Param
No.
2:
3:
Note: Refer to Figure 25-1 for load conditions.
(CKP = 0)
(CKP = 1)
SCK
SDO
SS
SCK
SDI
TscL
TscH
TscF
TscR
TdoF
TdoR
TscH2doV,
TscL2doV
TdiV2scH,
TdiV2scL
TscH2diL,
TscL2diL
TssL2scH,
TssL2scL
TssH2doZ
TscH2ssH
X
TscL2ssH
X
Symbol
These parameters are characterized but not tested in manufacturing.
Data in “Typ” column is at 3.3V, 25°C unless otherwise stated.
Assumes 50 pF load on all SPIx pins.
X
X
X
SCKx Input Low Time
SCKx Input Fall Time
SCKx Input Rise Time
SDOx Data Output Rise Time
SDOx Data Output Valid after
SCKx Edge
Setup Time of SDIx Data Input
to SCKx Edge
Hold Time of SDIx Data Input
to SCKx Edge
SSx to SCKx or SCKx Input
SSx to SDOx Output
High-Impedance
SSx after SCKx Edge
SCKx Input High Time
SDOx Data Output Fall Time
SPIx MODULE SLAVE MODE (CKE = 0) TIMING CHARACTERISTICS
SP50
Characteristic
SP35
SP71
SP40
(3)
MSb In
MSb
SP70
SP41
(3)
(3)
(1)
SP30,SP31
(3)
Preliminary
(3)
1.5 T
Bit 14 - - - -1
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature
Bit 14 - - - - - -1
Min
120
CY
30
30
20
20
10
—
—
—
—
—
+ 40
SP73
SP72
Typ
10
10
—
—
—
—
—
—
—
—
—
—
(2)
SP72
SP73
LSb
LSb In
Max
25
25
30
50
—
—
—
—
—
—
—
—
SP52
-40°C T
-40°C T
2009 Microchip Technology Inc.
Units
SP51
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
A
A
+85°C
+125°C for Extended
See parameter D032
See parameter D031
Conditions
—
—
—
—
—
—
—
—
—
—
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