DSPIC33FJ256GP710A-H/PT Microchip Technology, DSPIC33FJ256GP710A-H/PT Datasheet - Page 327
![16 Bit MCU/DSP 100LD 40MIPS 256KB FLASH 100 TQFP 12x12x1mm TRAY](/photos/16/3/160366/tqfp-100_sml.jpg)
DSPIC33FJ256GP710A-H/PT
Manufacturer Part Number
DSPIC33FJ256GP710A-H/PT
Description
16 Bit MCU/DSP 100LD 40MIPS 256KB FLASH 100 TQFP 12x12x1mm TRAY
Manufacturer
Microchip Technology
Series
dsPIC™ 33Fr
Datasheet
1.DSPIC33FJ64GP206A-IMR.pdf
(338 pages)
Specifications of DSPIC33FJ256GP710A-H/PT
Core Processor
dsPIC
Core Size
16-Bit
Speed
40 MIPs
Connectivity
CAN, I²C, IrDA, LIN, SPI, UART/USART
Peripherals
AC'97, Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Number Of I /o
85
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
30K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 32x10b/12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 140°C
Package / Case
100-TQFP
Processor Series
dsPIC33F
Core
dsPIC
Data Bus Width
16 bit
Interface Type
SPI, I2C, UART, JTAG
Number Of Programmable I/os
35
Operating Supply Voltage
3.3 V
Maximum Operating Temperature
+ 140 C
Mounting Style
SMD/SMT
Development Tools By Supplier
MPLAB IDE Software
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 13 Channel
A/d Bit Size
10 bit
A/d Channels Available
13
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Details
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DSPIC33FJ256GP710A-H/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
- Current page: 327 of 338
- Download datasheet (3Mb)
2009 Microchip Technology Inc.
100-Lead Plastic Thin Quad Flatpack (PF) – 14x14x1 mm Body, 2.00 mm Footprint [TQFP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Chamfers at corners are optional; size may vary.
3. Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.25 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
c
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
NOTE 1
b
e
β
N
Number of Leads
Lead Pitch
Overall Height
Molded Package Thickness
Standoff
Foot Length
Footprint
Foot Angle
Overall Width
Overall Length
Molded Package Width
Molded Package Length
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
1 2 3
dsPIC33FJXXXGPX06A/X08A/X10A
D
D1
Dimension Limits
Preliminary
NOTE 2
E1
φ
L
Units
A2
A1
E1
D1
L1
N
D
A
E
α
e
L
φ
c
b
β
E
A1
A
0.95
0.05
0.45
0.09
0.17
MIN
11°
11°
0°
–
L1
MILLIMETERS
16.00 BSC
16.00 BSC
14.00 BSC
14.00 BSC
0.50 BSC
1.00 REF
NOM
1.00
0.60
0.22
3.5°
100
12°
12°
–
–
–
Microchip Technology Drawing C04-110B
MAX
1.20
1.05
0.15
0.75
0.20
0.27
13°
13°
7°
DS70593B-page 327
A2
α
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