DSPIC33FJ256GP710A-H/PT Microchip Technology, DSPIC33FJ256GP710A-H/PT Datasheet - Page 308
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DSPIC33FJ256GP710A-H/PT
Manufacturer Part Number
DSPIC33FJ256GP710A-H/PT
Description
16 Bit MCU/DSP 100LD 40MIPS 256KB FLASH 100 TQFP 12x12x1mm TRAY
Manufacturer
Microchip Technology
Series
dsPIC™ 33Fr
Datasheet
1.DSPIC33FJ64GP206A-IMR.pdf
(338 pages)
Specifications of DSPIC33FJ256GP710A-H/PT
Core Processor
dsPIC
Core Size
16-Bit
Speed
40 MIPs
Connectivity
CAN, I²C, IrDA, LIN, SPI, UART/USART
Peripherals
AC'97, Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Number Of I /o
85
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
30K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 32x10b/12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 140°C
Package / Case
100-TQFP
Processor Series
dsPIC33F
Core
dsPIC
Data Bus Width
16 bit
Interface Type
SPI, I2C, UART, JTAG
Number Of Programmable I/os
35
Operating Supply Voltage
3.3 V
Maximum Operating Temperature
+ 140 C
Mounting Style
SMD/SMT
Development Tools By Supplier
MPLAB IDE Software
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 13 Channel
A/d Bit Size
10 bit
A/d Channels Available
13
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Details
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DSPIC33FJ256GP710A-H/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
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dsPIC33FJXXXGPX06A/X08A/X10A
26.1
TABLE 26-1:
TABLE 26-2:
TABLE 26-3:
TABLE 26-4:
DS70593B-page 308
High Temperature Devices
Power Dissipation:
Internal chip power dissipation:
I/O Pin Power Dissipation:
Maximum Allowed Power Dissipation
DC CHARACTERISTICS
Operating Voltage
HDC10
DC CHARACTERISTICS
Power-Down Current (I
HDC60e
HDC61c
Note 1:
Parameter
Parameter
Characteristic
No.
No.
2:
3:
4:
Operating Junction Temperature Range
High Temperature DC Characteristics
P
I/O = ({V
Operating Ambient Temperature Range
INT
Base I
pulled to V
The current is the additional current consumed when the module is enabled. This current should be
added to the base I
These currents are measured on the device containing the most memory in this family.
These parameters are characterized, but are not tested in manufacturing.
Supply Voltage
V
= V
Symbol
DD
DD
OPERATING MIPS VS. VOLTAGE
THERMAL OPERATING CONDITIONS
DC TEMPERATURE AND VOLTAGE SPECIFICATIONS
DC CHARACTERISTICS: POWER-DOWN CURRENT (I
PD
Typical
DD
250
x (I
is measured with all peripherals and clocks shut down. All I/Os are configured as inputs and
3
SS
- V
DD
. WDT, etc., are all switched off, and VREGS (RCON<8>) = 1.
PD
OH
- I
)
} x I
Characteristic
Rating
OH
PD
3.0V to 3.6V
V
OH
2000
(in Volts)
Max
DD
)
current.
5
) + (V
—
Range
OL
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature
x I
Units
A
A
OL
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature
)
Preliminary
Min
3.0
Temperature Range
+140°C
+140°C
-40°C to +140°C
Typ
3.3
(in °C)
-40°C T
Symbol
P
DMAX
Max
3.3V
3.3V
P
T
T
3.6
A
D
J
-40°C T
A
+140°C for High Temperature
Conditions
Units
Min
Base Power-Down Current
Watchdog Timer Current: I
-40
-40
PD
V
A
dsPIC33FJXXXGPX06A/X08A/
)
+140°C for High Temperature
(T
P
2009 Microchip Technology Inc.
INT
J
-40°C to +140°C
- T
Typ
—
—
+ P
A
)/
Max MIPS
I
/
JA
X10A
O
Conditions
20
+145
+140
Max
(1,3)
WDT (2,4)
Unit
°C
°C
W
W
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