CYIL1SE3000AA-GZDC Cypress Semiconductor Corp, CYIL1SE3000AA-GZDC Datasheet - Page 57

• Manufacturer Part Number: CYIL1SE3000AA-GZDC
• Description: IC IMAGE SENSOR 3MP 369-PGA
• Manufacturer: Cypress Semiconductor Corp

Specifications of CYIL1SE3000AA-GZDC

• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Mechanical Specifications
Table 51. Mechanical Specifications
Document Number: 001-44335 Rev. *C
Die (Referenced to
Pin 1 being bottom left
in
58)
Glass Lid
Specification
Mechanical shock
Vibration
Mounting Profile
Recommended
socket manufacturer
Figure 41
on page
Die thickness
Die center, X offset to the center of package
Die center, Y offset to the center of the package
Die position, X tilt
Die position, Y tilt
Die placement accuracy in package
Die rotation accuracy
Optical center referenced from the package center.
Optical center referenced from the package center.
Distance from PCB plane to top of the die surface
Distance from top of the die surface to top of the glass lid
X * Y size
Thickness
Spectral range for optical coating of window
Reflection coefficient for window
JESD22-B104C; Condition G
JESD22-B103B; Condition 1
Lead-free wave soldering profile for pin grid array package if no socket is used
Andon Electronics (http://www.andonelectronics.com)
Mechanical Specifications
PRELIMINARY
BGA Socket: 10-21-06-369-414T4-R27-L14
Thru Hole: 10-21-06-369-400T4-R27-L14
Min
400
-50
20
-1
-1
-1
28.2 x 19.5
1450
2000
-230
Typ
750
0
0
0
0
0
0
2
2
1
CYIL1SN3000AA
2000
1100
Max
<0.8
50
1
1
1
Page 57 of 61
Units
deg
deg
deg
mm
mm
mm
mm
µm
µm
µm
um
µm
µm
nm
Hz
%
G
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