ISP1508BET STEricsson, ISP1508BET Datasheet - Page 79

• Manufacturer Part Number: ISP1508BET
• Manufacturer: STEricsson

Specifications of ISP1508BET

• Lead Free Status / RoHS Status: Supplier Unconfirmed

NXP Semiconductors
20. Abbreviations
ISP1508A_ISP1508B_2
Product data sheet
19.4 Package related soldering information
Table 73.
[1]
[2]
Table 74.
Package
CPGA, HCPGA
DBS, DIP, HDIP, RDBS, SDIP, SIL
PMFP
Acronym
ASIC
ATX
CDM
CD-RW
DDR
EMI
EOP
ESD
ESR
FPGA
FS
HBM
HNP
HS
ID
IEC
LS
MM
NRZI
OTG
PDA
PHY
PID
PLL
POR
RXCMD
RXD
SDR
For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit
board.
For PMFP packages hot bar soldering or manual soldering is suitable.
[2]
Suitability of through-hole mount IC packages for dipping and wave soldering
Abbreviations
Description
Application-Specific Integrated Circuit
Analog USB Transceiver
Charge Device Model
Compact Disc-ReWritable
Dual Data Rate
ElectroMagnetic Interference
End-Of-Packet
ElectroStatic Discharge
Effective Series Resistance
Field Programmable Gate-Array
Full-Speed
Human Body Model
Host Negotiation Protocol
High-Speed
Identification
International Electrotechnical Commission
Low-Speed
Machine Model
Non-Return to Zero Inverted
On-The-Go
Personal Digital Assistant
Physical
Packet Identifier
Phase-Locked Loop
Power-On Reset
Receive Command
Receive Data
Single Data Rate
Rev. 02 — 13 March 2008
Soldering method
Dipping
-
suitable
-
ISP1508A; ISP1508B
ULPI HS USB OTG transceiver
Wave
suitable
suitable
not suitable
© NXP B.V. 2008. All rights reserved.
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