MT46H64M16LFCK-75:A TR Micron Technology Inc, MT46H64M16LFCK-75:A TR Datasheet - Page 20
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MT46H64M16LFCK-75:A TR
Manufacturer Part Number
MT46H64M16LFCK-75:A TR
Description
Manufacturer
Micron Technology Inc
Type
DDR SDRAMr
Datasheet
1.MT46H64M16LFCK-75A_TR.pdf
(96 pages)
Specifications of MT46H64M16LFCK-75:A TR
Organization
64Mx16
Density
1Gb
Address Bus
14b
Access Time (max)
6.5/6ns
Maximum Clock Rate
133MHz
Operating Supply Voltage (typ)
1.8V
Package Type
VFBGA
Operating Temp Range
0C to 70C
Operating Supply Voltage (max)
1.95V
Operating Supply Voltage (min)
1.7V
Supply Current
105mA
Pin Count
60
Mounting
Surface Mount
Operating Temperature Classification
Commercial
Lead Free Status / RoHS Status
Compliant
Electrical Specifications – I
Table 7: I
Notes 1–5 apply to all the parameters/conditions in this table; V
PDF: 09005aef82ce3074
1gb_ddr_mobile_sdram_t48m.pdf - Rev. L 04/10 EN
Parameter/Condition
Operating 1 bank active precharge current:
t
dress inputs are switching every 2 clock cycles; Data bus inputs
are stable
Precharge power-down standby current: All banks idle; CKE is
LOW; CS is HIGH;
switching; Data bus inputs are stable
Precharge power-down standby current: Clock stopped; All banks
idle; CKE is LOW; CS is HIGH; CK = LOW, CK# = HIGH; Address and
control inputs are switching; Data bus inputs are stable
Precharge nonpower-down standby current: All banks idle; CKE =
HIGH; CS = HIGH;
switching; Data bus inputs are stable
Precharge nonpower-down standby current: Clock stopped; All
banks idle; CKE = HIGH; CS = HIGH; CK = LOW, CK# = HIGH; Ad-
dress and control inputs are switching; Data bus inputs are stable
Active power-down standby current: 1 bank active; CKE = LOW;
CS = HIGH;
ing; Data bus inputs are stable
Active power-down standby current: Clock stopped; 1 bank ac-
tive; CKE = LOW; CS = HIGH; CK = LOW; CK# = HIGH; Address and
control inputs are switching; Data bus inputs are stable
Active nonpower-down standby: 1 bank active; CKE = HIGH; CS =
HIGH;
Data bus inputs are stable
Active nonpower-down standby: Clock stopped; 1 bank active;
CKE = HIGH; CS = HIGH; CK = LOW; CK# = HIGH; Address and con-
trol inputs are switching; Data bus inputs are stable
Operating burst read: 1 bank active; BL = 4;
tinuous READ bursts; I
every 2 clock cycles; 50% data changing each burst
Operating burst write: 1 bank active; BL = 4;
tinuous WRITE bursts; Address inputs are switching; 50% data
changing each burst
Auto refresh: Burst refresh; CKE = HIGH; Ad-
dress and control inputs are switching; Data bus
inputs are stable
Typical deep power-down current at 25°C: Address and control
balls are stable; Data bus inputs are stable
CK (MIN); CKE is HIGH; CS is HIGH between valid commands; Ad-
t
CK =
DD
t
CK =
t
CK (MIN); Address and control inputs are switching;
Specifications and Conditions (x16)
t
t
t
CK (MIN); Address and control inputs are switch-
CK =
CK =
OUT
t
t
CK (MIN); Address and control inputs are
CK (MIN); Address and control inputs are
= 0mA; Address inputs are switching
t
t
RC =
t
CK =
CK =
DD
t
t
t
t
RFC = 138ns
RFC =
Parameters
RC (MIN);
t
CK (MIN); Con-
CK (MIN); Con-
t
REFI
20
t
CK =
Electrical Specifications – I
DD
/V
DDQ
Symbol
I
I
I
I
I
1Gb: x16, x32 Mobile LPDDR SDRAM
I
I
I
I
I
I
DD2NS
DD3NS
DD2PS
DD3PS
DD4W
I
DD2N
DD3N
DD4R
I
DD5A
I
DD2P
DD3P
Micron Technology, Inc. reserves the right to change products or specifications without notice.
DD0
DD5
DD8
= 1.70–1.95V
130
130
140
80
18
14
20
14
15
-5
125
125
140
-54
75
17
13
19
14
15
Max
600
600
3.6
3.6
10
115
115
140
© 2007 Micron Technology, Inc. All rights reserved.
70
15
18
14
15
-6
8
DD
-75
105
105
140
60
12
16
12
14
8
Parameters
Unit Notes
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
μA
μA
μA
10, 11
7, 13
7, 8
10
6
7
9
9
8
6
6
6
6