TSPC106AMGS66CG E2V, TSPC106AMGS66CG Datasheet - Page 38

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TSPC106AMGS66CG

Manufacturer Part Number
TSPC106AMGS66CG
Description
Manufacturer
E2V
Datasheet

Specifications of TSPC106AMGS66CG

Operating Temperature Classification
Military
Operating Temperature (max)
125C
Rad Hardened
No
Lead Free Status / RoHS Status
Not Compliant
CI_CGA Package
Parameters
Table 23. CI-CGA Package Parameters
Figure 17. CI_CGA Mechanical Drawing
38
Parameter
Package outline
Interconnects
Pitch
Solder attach
Solder balls
Maximum module height
Co-planarity specification
TSPC106A
Top view
Bottom View
21 mm x 25 mm
303 (16 x 19 ball array minus one)
1.27 mm
63/37 Sn/Pb
10/90 Sn/Pb, 0.89 mm diameter
3.84 mm
0.15 mm
– F –
G
G
A
Min
A1
1 2 3 4 5 6 7 8 9 1011 1213141516
K
Br
N
Max
2X
W
V
U
T
R
P
N
M
L
K
J
H
G
F
E
D
C
B
A
– E –
P
2X
303X
0.200
Parameter
0.200
∅ D
A
B
C
D
G
H
K
N
P
C
0.150 T
∅ 0.300
∅ 0.150
*Not to scale
S T
S T
E
– T –
S
H
F
1.545
0.79
Min
S
0.635 BASIC
25.0 BASIC
21.0 BASIC
3.84 BASIC
1.27 BASIC
6.2 BASIC
7.6 BASIC
2102C–HIREL–01/05
1.695
Max
0.99

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