TSPC106AMGS66CG E2V, TSPC106AMGS66CG Datasheet - Page 38
TSPC106AMGS66CG
Manufacturer Part Number
TSPC106AMGS66CG
Description
Manufacturer
E2V
Datasheet
1.TSPC106AMGS66CG.pdf
(41 pages)
Specifications of TSPC106AMGS66CG
Operating Temperature Classification
Military
Operating Temperature (max)
125C
Rad Hardened
No
Lead Free Status / RoHS Status
Not Compliant
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CI_CGA Package
Parameters
Table 23. CI-CGA Package Parameters
Figure 17. CI_CGA Mechanical Drawing
38
Parameter
Package outline
Interconnects
Pitch
Solder attach
Solder balls
Maximum module height
Co-planarity specification
TSPC106A
Top view
Bottom View
21 mm x 25 mm
303 (16 x 19 ball array minus one)
1.27 mm
63/37 Sn/Pb
10/90 Sn/Pb, 0.89 mm diameter
3.84 mm
0.15 mm
– F –
G
G
A
Min
A1
1 2 3 4 5 6 7 8 9 1011 1213141516
K
Br
N
Max
2X
W
V
U
T
R
P
N
M
L
K
J
H
G
F
E
D
C
B
A
– E –
P
2X
303X
0.200
Parameter
0.200
∅ D
A
B
C
D
G
H
K
N
P
C
0.150 T
∅ 0.300
∅ 0.150
*Not to scale
S T
S T
E
– T –
S
H
F
1.545
0.79
Min
S
0.635 BASIC
25.0 BASIC
21.0 BASIC
3.84 BASIC
1.27 BASIC
6.2 BASIC
7.6 BASIC
2102C–HIREL–01/05
1.695
Max
0.99
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