ML610Q409-NNNTBZ03A7 Rohm Semiconductor, ML610Q409-NNNTBZ03A7 Datasheet - Page 372

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ML610Q409-NNNTBZ03A7

Manufacturer Part Number
ML610Q409-NNNTBZ03A7
Description
MCU 8BIT 16K FLASH 4CH 100-TQFP
Manufacturer
Rohm Semiconductor
Series
-r

Specifications of ML610Q409-NNNTBZ03A7

Core Processor
nX-U8/100
Core Size
8-Bit
Speed
2MHz
Connectivity
SSP, UART/USART
Peripherals
LCD, Melody Driver, POR, PWM, WDT
Number Of I /o
22
Program Memory Size
16KB (8K x 16)
Program Memory Type
FLASH
Eeprom Size
-
Ram Size
1K x 8
Voltage - Supply (vcc/vdd)
1.25 V ~ 3.6 V
Data Converters
A/D 2x16b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 70°C
Package / Case
100-TFQFP
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
ML610Q409-NNNTBZ03A7
Manufacturer:
Rohm Semiconductor
Quantity:
10 000
Appendix B Package Dimensions
Notes for Mounting the Surface Mount Type Package
The surface mount type packages are very susceptible to heat in reflow mounting and humidity absorbed in storage.
Therefore, before you perform reflow mounting, contact our responsible sales person on the product name, package name,
pin number, package code and desired mounting conditions (reflow method, temperature and times).
P-TQFP100-1414-0.50-ZK
B-1
Package material
Lead frame material
Lead finish
Solder thickness
Package weight (g)
Rev. No./Last Revised
Appendix B Package Dimensions
Epoxy resin
Cu alloy
Sn-2Bi (Bi 2%typ.)
More than 5μm
0.55typ.
2 / Oct. 22,2009
(Unit: mm)

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