MT47H32M16BN-37E:D Micron Technology Inc, MT47H32M16BN-37E:D Datasheet - Page 43
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MT47H32M16BN-37E:D
Manufacturer Part Number
MT47H32M16BN-37E:D
Description
Manufacturer
Micron Technology Inc
Type
DDR2 SDRAMr
Datasheet
1.MT47H32M16BN-37ED.pdf
(139 pages)
Specifications of MT47H32M16BN-37E:D
Organization
32Mx16
Density
512Mb
Address Bus
15b
Access Time (max)
500ps
Maximum Clock Rate
533MHz
Operating Supply Voltage (typ)
1.8V
Package Type
FBGA
Operating Temp Range
0C to 85C
Operating Supply Voltage (max)
1.9V
Operating Supply Voltage (min)
1.7V
Supply Current
205mA
Pin Count
84
Mounting
Surface Mount
Operating Temperature Classification
Commercial
Lead Free Status / Rohs Status
Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MT47H32M16BN-37E:D
Manufacturer:
MICRON
Quantity:
489
Company:
Part Number:
MT47H32M16BN-37E:D
Manufacturer:
MICRON
Quantity:
319
Company:
Part Number:
MT47H32M16BN-37E:D TR
Manufacturer:
Micron Technology Inc
Quantity:
10 000
PDF: 09005aef82f1e6e2
Rev. M 9/08 EN
Notes:
10. MIN (
11.
12. The period jitter (
13. The half-period jitter (
14. The cycle-to-cycle jitter (
15. The cumulative jitter error (
16. JEDEC specifies using
17. This parameter is not referenced to a specific voltage level but is specified when the de-
1. All voltages are referenced to Vss.
2. Tests for AC timing, Idd, and electrical AC and DC characteristics may be conducted at
3. Outputs measured with equivalent load (see Figure 18 (page 52)).
4. AC timing and Idd tests may use a Vil-to-Vih swing of up to 1.0V in the test environ-
5. The AC and DC input level specifications are as defined in the SSTL_18 standard (that is,
6. CK and CK# input slew rate is referenced at 1 V/ns (2 V/ns if measured differentially).
7. Operating frequency is only allowed to change during self refresh mode (see Figure 81
8. The clock’s
9. Spread spectrum is not included in the jitter specification values. However, the input
nominal reference/supply voltage levels, but the related specifications and the opera-
tion of the device are warranted for the full voltage range specified. ODT is disabled for
all measurements that are not ODT-specific.
ment, and parameter specifications are guaranteed for the specified AC input levels
under normal use conditions. The slew rate for the input signals used to test the device
is 1.0 V/ns for signals in the range between Vil(AC) and Vih(AC). Slew rates other than
1.0 V/ns may require the timing parameters to be derated as specified.
the receiver will effectively switch as a result of the signal crossing the AC input level
and will remain in that state as long as the signal does not ring back above [below] the
DC input LOW [HIGH] level).
(page 130)), precharge power-down mode, or system reset condition (see Reset
(page 131)). SSC allows for small deviations in operating frequency, provided the SSC
guidelines are satisfied.
t
clock jitter). Input clock jitter is allowed provided it does not exceed values specified.
Also, the jitter must be of a random Gaussian distribution in nature.
clock can accommodate spread spectrum at a sweep rate in the range 20–60 kHz with
an additional one percent
rate below
HIGH time driven to the device. The clock’s half period must also be of a Gaussian distri-
bution;
without duty cycle jitter.
tive CK falling edges.
that the absolute half period limits (
t
thus,
or nominal clock allowed in either the positive or negative direction. JEDEC specifies
tighter jitter numbers during DLL locking time. During DLL lock time, the jitter values
should be 20 percent less those than noted in the table (DLL locked).
of clock; however, the two cumulatively can not exceed
to the next. JEDEC specifies tighter jitter numbers during DLL locking time. During DLL
lock time, the jitter values should be 20 percent less than those noted in the table (DLL
locked).
of clock time allowed to consecutively accumulate away from the average clock over
any number of clock cycles.
19 and 48). Micron requires less derating by allowing
vice output is no longer driving (
CK (AVG) MIN is the smallest clock rate allowed (except for a deviation due to allowed
HP (MIN) is the lesser of
t
t
CL,
HP (MIN) ≥ the lesser of
t
CH (AVG) and
t
CH) refers to the smaller of the actual clock LOW time and the actual clock
t
t
CK (AVG) is the average clock over any 200 consecutive clocks and
CK (AVG) MIN or above
t
JITper) is the maximum deviation in the clock period from the average
t
t
ERR
CH limits may be exceeded if the duty cycle jitter is small enough
t
t
JITdty) applies to either the high pulse of clock or the low pulse
CL (AVG) must be met with or without clock jitter and with or
t
JITcc) is the amount the clock period can deviate from one cycle
t
t
CL and
CH (AVG) and
43
6–10per
t
CK (AVG); however, the spread spectrum may not use a clock
t
ERR
t
CL (ABS) MIN and
nper
when derating clock-related output timing (see notes
t
t
RPST) or beginning to drive (
CH actually applied to the device CK and CK# inputs;
), where n is 2, 3, 4, 5, 6–10, or 11–50 is the amount
AC Timing Operating Specifications
t
t
Micron Technology, Inc. reserves the right to change products or specifications without notice.
CK (AVG) MAX.
CH [ABS],
t
512Mb: x4, x8, x16 DDR2 SDRAM
CL (AVG) are the average of any 200 consecu-
t
CL [ABS]) are not violated.
t
CH (ABS) MIN.
t
ERR
t
JITper.
5per
© 2004 Micron Technology, Inc. All rights reserved.
to be used.
t
RPRE).