MT29F1G08ABADAH4:D Micron Technology Inc, MT29F1G08ABADAH4:D Datasheet - Page 78
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MT29F1G08ABADAH4:D
Manufacturer Part Number
MT29F1G08ABADAH4:D
Description
MICMT29F1G08ABADAH4:D 1GB SLC NAND BGA
Manufacturer
Micron Technology Inc
Datasheet
1.MT29F1G08ABADAH4D.pdf
(93 pages)
Specifications of MT29F1G08ABADAH4:D
Cell Type
NAND
Density
8Gb
Interface Type
Parallel
Address Bus
27b
Operating Supply Voltage (typ)
3.3V
Operating Temp Range
0C to 70C
Package Type
VFBGA
Sync/async
Asynchronous
Operating Temperature Classification
Commercial
Operating Supply Voltage (min)
2.7V
Operating Supply Voltage (max)
3.6V
Word Size
8b
Number Of Words
128M
Supply Current
35mA
Mounting
Surface Mount
Pin Count
63
Lead Free Status / Rohs Status
Supplier Unconfirmed
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MT29F1G08ABADAH4:D
Manufacturer:
ROHM
Quantity:
1 001
Company:
Part Number:
MT29F1G08ABADAH4:D
Manufacturer:
MICRON
Quantity:
2 690
Company:
Part Number:
MT29F1G08ABADAH4:D
Manufacturer:
Micron Technology Inc
Quantity:
10 000
Table 23: AC Characteristics: Normal Operation (3.3V)
Note 1 applies to all
Table 24: AC Characteristics: Normal Operation (1.8V)
Note 1 applies to all
PDF: 09005aef83e5ffed
m68a.pdf – Rev. D 06/10 EN
Parameter
ALE to RE# delay
CE# access time
CE# HIGH to output High-Z
CLE to RE# delay
CE# HIGH to output hold
Output High-Z to RE# LOW
READ cycle time
RE# access time
RE# HIGH hold time
RE# HIGH to output hold
RE# HIGH to WE# LOW
RE# HIGH to output High-Z
RE# LOW to output hold
RE# pulse width
Ready to RE# LOW
Reset time (READ/PROGRAM/ERASE)
WE# HIGH to busy
WE# HIGH to RE# LOW
Parameter
ALE to RE# delay
CE# access time
CE# HIGH to output High-Z
CLE to RE# delay
CE# HIGH to output hold
Output High-Z to RE# LOW
READ cycle time
RE# access time
RE# HIGH hold time
RE# HIGH to output hold
RE# HIGH to WE# LOW
Notes:
1. AC characteristics may need to be relaxed if I/O drive strength is not set to full.
2. Transition is measured ±200mV from steady-state voltage with load. This parameter is
3. The first time the RESET (FFh) command is issued while the device is idle, the device will
sampled and not 100% tested.
go busy for a maximum of 1ms. Thereafter, the device goes busy for a maximum of 5µs.
Electrical Specifications – AC Characteristics and Operating
Symbol
t
Symbol
t
t
t
RHOH
t
RLOH
t
t
t
t
t
t
t
RHW
t
WHR
COH
t
RHOH
t
t
CEA
CHZ
REA
REH
RHZ
t
CLR
t
t
t
RST
WB
t
t
t
t
t
t
RHW
AR
RC
RP
RR
COH
t
CEA
CHZ
t
REA
REH
IR
CLR
t
AR
RC
IR
78
Micron Technology, Inc. reserves the right to change products or specifications without notice.
Min
100
Min
10
10
15
20
15
10
20
60
100
10
10
15
25
10
15
1Gb x8, x16: NAND Flash Memory
–
–
0
–
7
–
5
–
–
0
–
–
–
5/10/500
Max
Max
100
100
25
50
16
25
50
22
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
© 2010 Micron Technology, Inc. All rights reserved.
Unit
Unit
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
µs
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
Conditions
Notes
Notes
2
2
3
2