EP3C40F484C8N Altera, EP3C40F484C8N Datasheet - Page 140

IC CYCLONE III FPGA 40K 484FBGA

EP3C40F484C8N

Manufacturer Part Number
EP3C40F484C8N
Description
IC CYCLONE III FPGA 40K 484FBGA
Manufacturer
Altera
Series
Cyclone® IIIr

Specifications of EP3C40F484C8N

Number Of Logic Elements/cells
39600
Number Of Labs/clbs
2475
Total Ram Bits
1161216
Number Of I /o
331
Voltage - Supply
1.15 V ~ 1.25 V
Mounting Type
Surface Mount
Operating Temperature
0°C ~ 85°C
Package / Case
484-FBGA
Family Name
Cyclone III
Number Of Logic Blocks/elements
39600
# I/os (max)
331
Frequency (max)
402MHz
Process Technology
65nm
Operating Supply Voltage (typ)
1.2V
Logic Cells
39600
Ram Bits
1161216
Operating Supply Voltage (min)
1.15V
Operating Supply Voltage (max)
1.25V
Operating Temp Range
0C to 85C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Pin Count
484
Package Type
FBGA
No. Of Logic Blocks
2475
Family Type
Cyclone III
No. Of I/o's
331
I/o Supply Voltage
3.3V
Operating Frequency Max
402MHz
Operating Temperature Range
0°C To +85°C
Rohs Compliant
Yes
For Use With
544-2601 - KIT DEV CYCLONE III LS EP3CLS200544-2411 - KIT DEV NIOS II CYCLONE III ED.
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Number Of Gates
-
Lead Free Status / Rohs Status
Compliant
Other names
544-2492

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7–16
High-Speed I/O Timing
Table 7–5. High-Speed I/O Timing Definitions
Figure 7–15. High-Speed I/O Timing Diagram
Cyclone III Device Handbook, Volume 1
Transmitter channel-to-channel skew
Sampling window
Receiver input skew margin
Input jitter tolerance (peak-to-peak)
Output jitter (peak-to-peak)
Note to
(1) The TCCS specification applies to the entire bank of differential I/O as long as the SERDES logic is placed in the logic array block (LAB) adjacent
to the output pins.
Table
7–5:
Parameter
This section discusses the timing budget, waveforms, and specifications for
source-synchronous signaling in the Cyclone III device family. Timing for
source-synchronous signaling is based on skew between the data and clock signals.
High-speed differential data transmission requires timing parameters provided by IC
vendors and requires you to consider the board skew, cable skew, and clock jitter. This
section provides information about high-speed I/O standards timing parameters in
the Cyclone III device family.
Table 7–5
Internal Clock
Input Clock
Input Data
Receiver
External
lists the parameters of the timing diagram as shown in
(1)
TCCS
TCCS
SW
RSKM
Symbol
RSKM
Chapter 7: High-Speed Differential Interfaces in the Cyclone III Device Family
The timing difference between the fastest and slowest output
edges, including t
included in the TCCS measurement.
The period of time during which the data must be valid in order
for you to capture it correctly. The setup and hold times
determine the ideal strobe position in the sampling window.
T
RSKM is defined by the total margin left after accounting for the
sampling window and TCCS. The RSKM equation is:
Allowed input jitter on the input clock to the PLL that is tolerable
while maintaining PLL lock.
Peak-to-peak output jitter from the PLL.
RSKM
SW
Sampling Window (SW)
Time Unit Interval (TUI)
= T
SU
=
+ T
(
--------------------------------------------- -
TUI SW TCCS
hd
+ PLL jitter.
CO
2
variation and clock skew. The clock is
RSKM
Description
)
TCCS
© December 2009 Altera Corporation
Figure
High-Speed I/O Timing
7–15.

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