MPC8560PX833LB Freescale Semiconductor, MPC8560PX833LB Datasheet - Page 87

• Manufacturer Part Number: MPC8560PX833LB
• Description: IC MPU POWERQUICC III 783-FCPBGA
• Manufacturer: Freescale Semiconductor

Specifications of MPC8560PX833LB

• Processor Type: MPC85xx PowerQUICC III 32-Bit
• Speed: 833MHz
• Voltage: 1.2V
• Mounting Type: Surface Mount
• Package / Case: 783-FCPBGA
• Family Name: MPC85XX
• Device Core: PowerQUICC III
• Device Core Size: 32b
• Frequency (max): 833MHz
• Instruction Set Architecture: RISC
• Supply Voltage 1 (typ): 1.2V
• Operating Supply Voltage (max): 1.26V
• Operating Supply Voltage (min): 1.14V
• Operating Temp Range: 0C to 105C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 783
• Package Type: FCBGA
• For Use With: MPC8560ADS-BGA - BOARD APPLICATION DEV 8560
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Features: -
• Lead Free Status / Rohs Status: Not Compliant

16.2.4
The following section provides a heat sink selection example using one of the commercially available heat
sinks.
16.2.4.1
For preliminary heat sink sizing, the die-junction temperature can be expressed as follows:
where
During operation the die-junction temperatures (T
Table
and the air temperature rise within the electronic cabinet. An electronic cabinet inlet-air temperature (T
may range from 30° to 40°C. The air temperature rise within a cabinet (T
10°C. The thermal resistance of some thermal interface material (θ
T
following expression for T
The heat sink-to-ambient thermal resistance (θ
#2328B is shown in
Assuming an air velocity of 2 m/s, we have an effective θ
resulting in a die-junction temperature of approximately 71 C which is well within the maximum
operating temperature of the component.
Freescale Semiconductor
I
of 30 C, a T
2. The temperature of air cooling the component greatly depends on the ambient inlet air temperature
Thermagon Inc.
4707 Detroit Ave.
Cleveland, OH 44102
Internet: www.thermagon.com
T
T
T
θ
θ
θ
P
JC
INT
SA
D
J
I
R
is the die-junction temperature
is the inlet cabinet ambient temperature
is the power dissipated by the device
is the air temperature rise within the computer cabinet
Die-junction temperature: T
is the junction-to-case thermal resistance
is the heat sink base-to-ambient thermal resistance
Heat Sink Selection Examples
is the adhesive or interface material thermal resistance
Case 1
T
T
J
J
R
= T
= 30 C + 5 C + (0.8 C/W +1.0 C/W + 3.3 C/W) × 7.0 W,
of 5 C, a FC-PBGA package θ
Figure
I
+ T
MPC8560 Integrated Processor Hardware Specifications, Rev. 5
R
J
+ (θ
55.
is obtained:
JC
+ θ
INT
J
= 30°C + 5°C + (0.8°C/W + 1.0°C/W + θ
+ θ
SA
SA
) × P
) versus airflow velocity for a Thermalloy heat sink
JC
J
) should be maintained within the range specified in
D
= 0.8, and a power consumption (P
SA+
888-246-9050
of about 3.3 C/W, thus
INT
) may be about 1°C/W. Assuming a
R
) may be in the range of 5° to
SA
) × 7.0 W
D
) of 7.0 W, the
Thermal
A
87
)