VSC8641XKO Vitesse Semiconductor Corp, VSC8641XKO Datasheet - Page 117

• Manufacturer Part Number: VSC8641XKO
• Description: IC PHY 10/100/1000 100-LQFP
• Manufacturer: Vitesse Semiconductor Corp
• Type: PHY Transceiverr

Specifications of VSC8641XKO

• Number Of Drivers/receivers: 1/1
• Protocol: Gigabit Ethernet
• Voltage - Supply: 2.5V, 3.3V
• Mounting Type: Surface Mount
• Package / Case: 100-LQFP
• Case: TQFP
• Dc: 07+
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 907-1031

7.2
Table 97.
7.3
Revision 4.3
August 2009
Thermal Specifications
Thermal specifications for this device are based on the JEDEC standard EIA/JESD51-2
and have been modeled using a four-layer test board with two signal layers, a power
plane, ad a ground plane (2s2p PCB). For more information, see the JEDEC standard.
Thermal Resistances
1. Simulated on the top of the mold compound with the exposed pad soldered to a ground pad on
2. Calculated on the exposed pad soldered to a ground pad on the PCB.
To achieve results similar to the modeled thermal resistance measurements, the
guidelines for board design described in the JEDEC standard EIA/JESD51 series must be
applied. For information about specific applications, see the following:
EIA/JESD51-5, Extension of Thermal Test Board Standards for Packages with Direct
Thermal Attachment Mechanisms
EIA/JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface
Mount Packages
EIA/JESD51-9, Test Boards for Area Array Surface Mount Package Thermal
Measurements
EIA/JESD51-10, Test Boards for Through-Hole Perimeter Leaded Package Thermal
Measurements
EIA/JESD51-11, Test Boards for Through-Hole Area Array Leaded Package Thermal
Measurements
Moisture Sensitivity
This device is rated moisture sensitivity level 3 or better as specified in the joint IPC
and JEDEC standard IPC/JEDEC J-STD-020. For more information, see the IPC and
JEDEC standard.
Part Order Number
VSC8641XJF
VSC8641XKO
VSC8641XKO-03
the PCB.
14.7
14.7
3.2
6.4
6.4
7
θ
(1)
JC
(2)
(2)
(2)
(1)
(1)
16.7
θ
19
19
JB
θ
JA
24
29
29
0
(°C/W) vs. Airflow (ft/min)
100
Package Information
22
26
26
VSC8641 Datasheet
Page 117
19.5
200
25
25