MC9S08GT16CFB Freescale Semiconductor, MC9S08GT16CFB Datasheet - Page 22

MC9S08GT16CFB

Manufacturer Part Number
MC9S08GT16CFB
Description
Manufacturer
Freescale Semiconductor
Datasheet

Specifications of MC9S08GT16CFB

Cpu Family
HCS08
Device Core Size
8b
Frequency (max)
20MHz
Interface Type
SCI/SPI
Program Memory Type
Flash
Program Memory Size
16KB
Total Internal Ram Size
1KB
# I/os (max)
36
Number Of Timers - General Purpose
4
Operating Supply Voltage (typ)
2.5/3.3V
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
2.08V
On-chip Adc
8-chx10-bit
Instruction Set Architecture
CISC
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
44
Package Type
PQFP
Lead Free Status / Rohs Status
Not Compliant

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Chapter 1 Introduction
22
FFE is a control signal generated inside the ICG. If the frequency of ICGOUT > 4 × the frequency
of ICGERCLK, this signal is a logic 1 and the fixed-frequency clock will be the ICGERCLK.
Otherwise the fixed-frequency clock will be BUSCLK.
ICGLCLK — Development tools can select this internal self-clocked source (~ 8 MHz) to speed
up BDC communications in systems where the bus clock is slow.
ICGERCLK — External reference clock can be selected as the real-time interrupt clock source.
MC9S08GB/GT Data Sheet, Rev. 2.3
Freescale Semiconductor

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