IDT88P8341 Integrated Device Technology, IDT88P8341 Datasheet - Page 92
IDT88P8341
Manufacturer Part Number
IDT88P8341
Description
Spi Exchange Spi-3 To Spi-4
Manufacturer
Integrated Device Technology
Datasheet
1.IDT88P8341.pdf
(96 pages)
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IDT88P8341 SPI EXCHANGE SPI-3 TO SPI-4
INDUSTRIAL TEMPERATURE RANGE
12.3 Device package
The SPI Exchange IDT88P8341 device is packaged in a 35 mm by 35 mm
820-ball one millimeter ball pitch thermally-enhanced plastic ball grid array. All
balls, whether used or unused, must be soldered to pads.
Figure 41. IDT88P8341 820PBGA package, bottom view
APRIL 10, 2006
92
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