MC72000 Freescale Semiconductor, MC72000 Datasheet

MC72000

Manufacturer Part Number

MC72000

Description

Integrated Bluetooth Radio

Manufacturer

Freescale Semiconductor

Datasheet

1.MC72000.pdf (157 pages)

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Advance Information

Data Sheet

MC72000/D

Rev. 2.6, 1/2003

MC72000 Integrated

Bluetooth™ Radio

Contents

1 MC72000 Features . . . . 2

2 System Overview . . . . . . 3

3 Electrical

4 Package Pinout . . . . . . 17

5 System Description . . . 27

6 Radio Functional

7 Hardware Functional

8 Bluetooth Baseband

9 HCI Features. . . . . . . . 134

10 Applications

11 Application Example

12 Mechanical Outline

Appendix A: Radio

This document contains information on a new product. Specifications and information herein are subject to change

Characteristics. . . . . . . . 4

Description . . . . . . . . . . 31

Description . . . . . . . . . . 49

Functionality

Overview. . . . . . . . . . . 126

Information . . . . . . . . . 139

Evaluation Printed Circuit

Boards . . . . . . . . . . . . 150

(Package

Information) . . . . . . . . 151

The MC72000 Integrated Bluetooth™ Radio provides a complete, low-power Bluetooth

radio solution. The design is based on Motorola’s third-generation Bluetooth architecture

that has set a high standard for interoperability, complete functionality, and compliance with

the Bluetooth specification.

The MC72000 Integrated Bluetooth Radio from Motorola implements the RF and baseband

host controller interface (HCI) of the Bluetooth protocol in a small 7 mm x 7 mm BGA

package. The MC72000 is the ideal solution for low-power, short-range Bluetooth

applications with small size constraints and includes superior performance features like a

dedicated Bluetooth audio processor module and on-chip memory. Debug and production

test are fully supported through the joint test action group (JTAG) interface.

The RF portion of the radio provides a unique combination of high sensitivity, excellent C/I

performance, and low power consumption. These performance parameters are extremely

important to maintaining a robust link in high RF interference environments created by

devices such as mobile phones, high density Bluetooth networks, 802.11b networks, and

microwave ovens.

The MC72000 uses an innovative, highly advanced packaging technique to combine two

die—the RF and baseband functions—into a single, cost-effective package. Motorola’s

optimized two-chip architecture avoids compromises between cost and performance that

other one-chip solutions must make. With Motorola’s integrated solution, customers get the

best of both. Each die is implemented in its optimal process technology to deliver low cost,

low power, and small size.

Preliminary

Freescale Semiconductor, Inc.

For More Information On This Product,

Go to: www.freescale.com

MC72000

Device

MC72000

Ordering Information

Temperature Range

Package Information

-40° C to 85° C

Plastic Package

(MAPBGA–100)

Operating

Case 1398-01

MAPBGA – 100

Package

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