SPC5561MZQ132 Freescale Semiconductor / Motorola, SPC5561MZQ132 Datasheet - Page 5

• Manufacturer Part Number: SPC5561MZQ132
• Description: Power Architecture TM 32-bit MCU for Automotive
• Manufacturer: Freescale Semiconductor / Motorola

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3.2
The shaded rows in the following table indicate information specific to a four-layer board.
Freescale Semiconductor
Spec
Spec
Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board) temperature,
ambient temperature, air flow, power dissipation of other components on the board, and board thermal resistance.
Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board horizontal.
Per JEDEC JESD51-6 with the board horizontal.
Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on
the top surface of the board near the package.
Indicates the average thermal resistance between the die and the case top surface as measured by the cold plate method (MIL
SPEC-883 Method 1012.1) with the cold plate temperature used for the case temperature.
Thermal characterization parameter indicating the temperature difference between package top and the junction temperature
per JEDEC JESD51-2.
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Functional operating conditions are given in the DC electrical specifications. Absolute maximum ratings are stress ratings only,
and functional operation at the maxima is not guaranteed. Stress beyond any of the listed maxima can affect device reliability
or cause permanent damage to the device.
1.5 V ± 10% for proper operation. This parameter is specified at a maximum junction temperature of 150
All functional non-supply I/O pins are clamped to V
AC signal overshoot and undershoot of up to ± 2.0 V of the input voltages is permitted for an accumulative duration of
60 hours over the complete lifetime of the device (injection current not limited for this duration).
Internal structures hold the voltage greater than –1.0 V if the injection current limit of 2 mA is met. Keep the negative DC
voltage greater than –0.6 V on SINB during the internal power-on reset (POR) state.
Internal structures hold the input voltage less than the maximum voltage on all pads powered by V
maximum injection current specification is met (2 mA for all pins) and V
Internal structures hold the input voltage less than the maximum voltage on all pads powered by V
injection current specification is met (2 mA for all pins) and V
Total injection current for all pins (including both digital and analog) must not exceed 25 mA.
Total injection current for all analog input pins must not exceed 15 mA.
Lifetime operation at these specification limits is not guaranteed.
Moisture sensitivity profile per IPC/JEDEC J-STD-020D.
Moisture sensitivity per JEDEC test method A112.
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Maximum solder temperature
Moisture sensitivity level
Junction to ambient
Junction to ambient
Junction to ambient (@200 ft./min., one-layer board)
Junction to ambient (@200 ft./min., four-layer board 2s2p)
Junction to board (four-layer board 2s2p)
Junction to case
Junction to package top, natural convection
Lead free (Pb-free)
Leaded (SnPb)
Thermal Characteristics
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Table 3. MPC5561 Thermal Characteristics (Preliminary Values)
MPC5561 Thermal Characteristic
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1, 3
Characteristic
, natural convection (one-layer board)
, natural convection (four-layer board 2s2p)
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Table 2. Absolute Maximum Ratings
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MPC5561 Microcontroller Data Sheet, Rev. 2.0
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SS
and V
DDE
DDE
, or V
is within the operating voltage specifications.
DDEH
DDEH
Symbol
.
1
T
MSL
SDR
is within the operating voltage specifications.
(continued)
Symbol
R
R
R
R
R
R
Ψ
θJMA
θJMA
θJC
θJA
θJA
θJB
JT
Min.
—
—
—
DDE
Electrical Characteristics
DDEH
324 PBGA
supplies, if the maximum
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19
22
16
10
7
2
supplies, if the
o
260.0
245.0
Max.
C.
3
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
Unit
o
C
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