k4b2g0846b Samsung Semiconductor, Inc., k4b2g0846b Datasheet - Page 28

no-image

k4b2g0846b

Manufacturer Part Number
k4b2g0846b
Description
2gb B-die Ddr3 Sdram Specification
Manufacturer
Samsung Semiconductor, Inc.
Datasheet

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
k4b2g0846b-HCF7
Manufacturer:
SAMSUNG
Quantity:
985
Part Number:
k4b2g0846b-HCH9
Manufacturer:
SAMSUNG
Quantity:
11 581
Part Number:
k4b2g0846b-HCH9
Manufacturer:
TI
Quantity:
19
Part Number:
k4b2g0846b-HCH9
Manufacturer:
SAMSUNG
Quantity:
1 000
Part Number:
k4b2g0846b-HCK0
Manufacturer:
SAMSUNG
Quantity:
11 586
Part Number:
k4b2g0846b-HYF7
Manufacturer:
SAMSUNG
Quantity:
1 200
K4B2G04(08/16)46B
Figure 17. Definition of tAOFPD
Figure 18. Definition of tADC
CK
CK
CK
CK
DQ, DM
DQS , DQS
TDQS , TDQS
DQ, DM
DQS , DQS
TDQS , TDQS
Begin point : Rising edge of CK - CK
with ODT being first registered low
Begin point : Rising edge of CK - CK
defined by the end point of ODTLcnw
V
V
RTT_Nom
RTT_Nom
End point
Extrapolated point
at V
V
SW2
RTT_Nom
V
SW1
t
End point Extrapolated point at V
t
End point Extrapolated point at V
AOFPD
ADC
T
T
SW2
SW21
T
SW1
T
SW11
V
Begin point : Rising edge of CK - CK defined by
the end point of ODTLcwn4 or ODTLcwn8
SW1
Page 28 of 61
V
SW2
V
RTT_Wr
RTT_Nom
RTT_Nom
End point Extrapolated point at V
t
ADC
T
V
SW12
SSQ
V
T
SW22
TT
V
RTT_Nom
2Gb DDR3 SDRAM
Rev. 1.0 December 2008
RTT_Wr
V
SSQ
V
TT

Related parts for k4b2g0846b