EPM570 Altera, EPM570 Datasheet - Page 55

• Manufacturer Part Number: EPM570
• Description: MAX II Device Family
• Manufacturer: Altera

Hot Socketing
Altera Corporation
December 2004
MII51004-1.2
MAX
swap, and power sequencing support. Designers can insert or remove a
MAX II board in a system during operation without undesirable effects to
the system bus. The hot socketing feature removes some of the difficulty
designers face when using components on printed circuit boards (PCBs)
that contain a mixture of 3.3-, 2.5-, 1.8-, and 1.5-V devices.
The MAX II device hot socketing feature provides:
■
■
■
MAX II Hot-Socketing Specifications
MAX II devices offer all three of the features required for hot socketing
capability listed above without any external components or special
design requirements. The following are hot-socketing specifications:
■
■
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Devices Can Be Driven before Power-Up
Signals can be driven into the MAX II device I/O pins and GCLK[3..0]
pins before or during power-up or power-down without damaging the
device. MAX II devices support any power-up or power-down sequence
(V
CCIO1
Board or device insertion and removal
Support for any power-up sequence
Non-intrusive I/O buffers to system buses during hot insertion
The device can be driven before and during power-up or power-
down without any damage to the device itself.
I/O pins remain tri-stated during power-up. The device does not
drive out before or during power-up, thereby affecting other buses in
operation.
Signal pins do not drive the V
input signals to I/O pins of the device do not internally power the
V
®
CCIO
II devices offer hot socketing, also known as hot plug-in or hot
, V
Core Version a.b.c variable
CCIO2
or V
, V
CCINT
CCIO3
Chapter 4. Hot Socketing &
power supplies of the device via internal paths.
, V
Power-On Reset in MAX II
CCIO4
, V
CCINT
CCIO
), simplifying system-level design.
or V
CCINT
power supplies. External
Devices
Preliminary
4–1