E28F016XS20 INTEL [Intel Corporation], E28F016XS20 Datasheet - Page 10

• Manufacturer Part Number: E28F016XS20
• Description: 16-MBIT (1 MBIT x 16, 2 MBIT x 8) SYNCHRONOUS FLASH MEMORY
• Manufacturer: INTEL [Intel Corporation]

28F016XS FLASH MEMORY
The
read/programs to the 28F016XS. BYTE# at logic
low selects 8-bit mode with address A
between low byte and high byte. On the other hand,
BYTE# at logic high enables 16-bit operation with
address A
address A
diagram is shown in Figure 1.
The 28F016XS incorporates an Automatic Power
Saving (APS) feature, which substantially reduces
the active current when the device is in static mode
of operation (addresses not switching). In APS
mode, the typical I
at 3.3V).
A deep power-down mode of operation is invoked
when the RP# (called PWD# on the 28F008SA) pin
transitions low. This mode brings the device power
consumption to less than 2.0 µA, typically, and
provides additional write protection by acting as a
device reset pin during power transitions. A reset
time of 300 ns (5V V
switching high before latching an address into the
10
28F016SA/SV
CE #
CE #
GND
3/5#
V
V
RP#
A
A
A
A
A
A
A
A
A
A
A
NC
A
A
A
A
A
A
A
A
A
CC
20
19
18
17
16
15
14
13
12
PP
11
10
1
0
9
7
6
5
4
3
2
1
the 28F016SA/SV, Allowing for Easy Performance Upgrades from Existing 16-Mbit Designs
8
BYTE#
1
0
Figure 2. 28F016XS 56-Lead TSOP Pinout Configuration Shows Compatibility with
becoming the lowest order address and
is not used (don’t care). A device block
CE #
CE #
GND
RP#
V
V
A
A
A
A
A
A
A
A
A
A
A
pin
3/5#
NC
A
A
A
A
A
A
A
A
A
CC
1
0
PP
20
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
CC
allows
current is 1 mA at 5.0V (3 mA
CC
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
) is required from RP#
either
x8
0
selecting
or
56-LEAD TSOP PINOUT
14 mm x 20 mm
x16
E28F016XS
TOP VIEW
28F016XS. In the deep power-down state, the
WSM is reset (any current operation will abort) and
the CSR, GSR and BSR registers are cleared.
A CMOS standby mode of operation is enabled
when either CE
stays high with all input control pins at CMOS
levels. In this mode, the device typically draws an
I
The 28F016XS is available in 56-Lead, 1.2 mm
thick, 14 mm x 20 mm TSOP and 1.8 mm thick, 16
mm x 23.7 mm SSOP Type I packages. The form
factor and pinout of these two packages allow for
very high board layout densities.
2.0
The 28F016XS is pinout compatible with the
28F016SA/SV 16-Mbit FlashFile memory com-
ponents, providing a performance upgrade path to
the 28F016XS. The 28F016XS 56-Lead TSOP and
SSOP pinout configurations are shown in Figures 2
and 3.
CC
standby current of 70 µA at 5V V
DEVICE PINOUT
0
# or CE
1
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
# transitions high and RP#
WP#
WE#
OE#
RY/BY#
DQ
DQ
DQ
DQ
GND
DQ
DQ
DQ
DQ
V
GND
DQ
DQ
DQ
DQ
V
DQ
DQ
DQ
DQ
A
BYTE#
ADV#
CLK
CC
CC
0
5
4
15
7
14
6
13
12
11
3
10
2
9
1
8
0
CC
.
28F016SA/SV
RY/BY#
BYTE#
DQ
DQ
DQ
DQ
DQ
DQ
DQ
WP#
WE#
OE#
DQ
DQ
GND
DQ
DQ
V
DQ
DQ
DQ
DQ
DQ
GND
V
NC
NC
A
CC
CC
0
12
15
11
14
13
9
8
0
7
6
5
4
10
1
3
2
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