DSPIC30F6010 MICROCHIP [Microchip Technology], DSPIC30F6010 Datasheet - Page 166

no-image

DSPIC30F6010

Manufacturer Part Number
DSPIC30F6010
Description
High-Performance Digital Signal Controllers
Manufacturer
MICROCHIP [Microchip Technology]
Datasheet

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DSPIC30F6010-20E/PF
Manufacturer:
Microchip Technology
Quantity:
10 000
Part Number:
DSPIC30F6010-20I/PF
Manufacturer:
Microchip Technology
Quantity:
10 000
Part Number:
DSPIC30F6010-20I/PF
Manufacturer:
MICROCHI
Quantity:
20 000
Part Number:
DSPIC30F6010-30I/PF
Manufacturer:
Microchip Technology
Quantity:
10 000
Part Number:
DSPIC30F6010-30I/PF
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
Part Number:
DSPIC30F6010A-20E/PF
Manufacturer:
Microchip Technology
Quantity:
10 000
Part Number:
DSPIC30F6010A-20E/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
Part Number:
DSPIC30F6010A-20E/PT
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
Part Number:
DSPIC30F6010A-20I/PF
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
Part Number:
DSPIC30F6010A-20I/PT
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
Part Number:
DSPIC30F6010A-30I/
Manufacturer:
TI
Quantity:
7 880
Part Number:
DSPIC30F6010A-30I/PF
Manufacturer:
AD
Quantity:
2 100
Part Number:
DSPIC30F6010A-30I/PF
0
Part Number:
DSPIC30F6010A-30I/PT
0
dsPIC30F6010
TABLE 24-2:
TABLE 24-3:
TABLE 24-4:
DS70119D-page 164
dsPIC30F6010-30I
dsPIC30F6010-20I
dsPIC30F6010-20E
Power Dissipation:
Internal chip power dissipation:
I/O Pin power dissipation:
Maximum Allowed Power Dissipation
Package Thermal Resistance, 80-pin TQFP (14x14x1mm)
Package Thermal Resistance, 64-pin TQFP (14x14x1mm)
Note 1:
DC CHARACTERISTICS
Operating Voltage
DC10
DC11
DC12
DC16
DC17
Note 1:
Param
No.
2:
3:
Operating Junction Temperature Range
Operating Junction Temperature Range
Operating Junction Temperature Range
Operating Ambient Temperature Range
Operating Ambient Temperature Range
Operating Ambient Temperature Range
P
P
V
V
V
V
S
I
INT
Symbol
/
Junction to ambient thermal resistance, Theta-ja (
Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and
are not tested.
These parameters are characterized but not tested in manufacturing.
This is the limit to which V
O
DD
DD
DR
POR
VDD
=
=
V
(
THERMAL OPERATING CONDITIONS
THERMAL PACKAGING CHARACTERISTICS
DC TEMPERATURE AND VOLTAGE SPECIFICATIONS
{
DD
V
(2)
Supply Voltage
Supply Voltage
RAM Data Retention Voltage
V
to ensure internal
Power-on Reset signal
V
to ensure internal
Power-on Reset signal
×
DD
DD
DD
(
I
D D
Start Voltage
Rise Rate
V
Characteristic
O H
}
Rating
Characteristic
×
I
O H
I
OH
)
)
DD
+
can be lowered without losing RAM data.
(
V
O L
×
I
Preliminary
OL
(3)
)
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature
0.05
Min
2.5
2.5
θ
JA
) numbers are achieved by package simulations.
Typ
V
1.5
SS
Symbol
Symbol
P
(1)
DMAX
θ
θ
P
T
T
T
T
T
T
JA
JA
A
A
A
D
J
J
J
Max
5.5
5.5
Min
Typ
-40
-40
-40
-40
-40
-40
50
50
-40°C ≤ T
-40°C ≤ T
Units
V/ms 0-5V in 0.1 sec
V
V
V
V
(T
 2004 Microchip Technology Inc.
P
J
INT
Industrial temperature
Extended temperature
0-3V in 60 ms
- T
Max
Typ
A
A
A
+ P
≤ +85°C for Industrial
≤ +125°C for Extended
) /
I
θ
/
O
Conditions
JA
°C/W
°C/W
+125
+150
+150
+125
Max
Unit
+85
+85
Notes
Unit
°C
°C
°C
°C
°C
°C
W
W
1
1

Related parts for DSPIC30F6010