MPC8306VMAFDCA Freescale Semiconductor, MPC8306VMAFDCA Datasheet - Page 65

• Manufacturer Part Number: MPC8306VMAFDCA
• Description: Microprocessors - MPU E300 MP 333
• Manufacturer: Freescale Semiconductor

Specifications of MPC8306VMAFDCA

• Rohs: yes
• Processor Series: PowerQUICC II Pro
• Core: e300
• Data Bus Width: 16 bit
• Maximum Clock Frequency: 233 MHz
• Program Memory Size: 16 KB
• Data Ram Size: 16 KB, 48 KB
• Interface Type: CAN, Ethernet, I2C, SPI, UART, USB
• Operating Supply Voltage: - 0.3 V to + 1.26 V
• Maximum Operating Temperature: + 105 C
• Mounting Style: SMD/SMT
• Package / Case: MAPBGA
• I/o Voltage: 1.8 V
• Minimum Operating Temperature: 0 C
• Number Of Programmable I/os: 56
• Number Of Timers: 8

23 Thermal
This section describes the thermal specifications of the MPC8306.
23.1
The following table provides the package thermal characteristics for the 369, 19  19 mm MAPBGA of
the MPC8306.
23.1.1
For the following sections, P
drivers.
23.1.2
An estimation of the chip junction temperature, T
where:
Freescale Semiconductor
Junction-to-ambient natural convection
Junction-to-ambient natural convection
Junction-to-ambient (@200 ft/min)
Junction-to-ambient (@200 ft/min)
Junction-to-board
Junction-to-case
Junction-to-package top
Notes:
1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)
2. Per JEDEC JESD51-2 with the single layer board horizontal. Board meets JESD51-9 specification.
3. Per JEDEC JESD51-6 with the board horizontal.
4. Thermal resistance between the die and the printed-circuit board per JEDEC JESD51-8. Board temperature is measured on
5. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method
6. Thermal characterization parameter indicating the temperature difference between package top and the junction temperature
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal
resistance.
the top surface of the board near the package.
1012.1).
per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written as Psi-JT.
MPC8306 PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 2
T
J
Thermal Characteristics
= junction temperature (C)
Thermal Management Information
Estimation of Junction Temperature with Junction-to-Ambient
Thermal Resistance
Characteristic
Table 61. Package Thermal Characteristics for MAPBGA
D
= (V
DD
T

J
Four-layer board (2s2p)
Four-layer board (2s2p)
I
Single-layer board (1s)
Single-layer board (1s)
= T
DD
Natural convection
A
) + P
Board type
+ (R  J
J
—
—
I/O
, can be obtained from the equation:
A
, where P

P
D
)
I/O
is the power dissipation of the I/O
Symbol
R
R
R
R
R
R

JMA
JMA
JC
JA
JA
JB
JT
Value
39
24
32
21
14
9
2
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
Notes
1, 2, 3
Thermal
Eqn. 1
1, 2
1, 3
1, 3
4
5
6
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