MPC8306VMAFDCA Freescale Semiconductor, MPC8306VMAFDCA Datasheet - Page 66

• Manufacturer Part Number: MPC8306VMAFDCA
• Description: Microprocessors - MPU E300 MP 333
• Manufacturer: Freescale Semiconductor

Specifications of MPC8306VMAFDCA

• Rohs: yes
• Processor Series: PowerQUICC II Pro
• Core: e300
• Data Bus Width: 16 bit
• Maximum Clock Frequency: 233 MHz
• Program Memory Size: 16 KB
• Data Ram Size: 16 KB, 48 KB
• Interface Type: CAN, Ethernet, I2C, SPI, UART, USB
• Operating Supply Voltage: - 0.3 V to + 1.26 V
• Maximum Operating Temperature: + 105 C
• Mounting Style: SMD/SMT
• Package / Case: MAPBGA
• I/o Voltage: 1.8 V
• Minimum Operating Temperature: 0 C
• Number Of Programmable I/os: 56
• Number Of Timers: 8

Thermal
The junction-to-ambient thermal resistance is an industry standard value that provides a quick and easy
estimation of thermal performance. As a general statement, the value obtained on a single layer board is
appropriate for a tightly packed printed-circuit board. The value obtained on the board with the internal
planes is usually appropriate if the board has low power dissipation and the components are well separated.
Test cases have demonstrated that errors of a factor of two (in the quantity T
23.1.3
The thermal performance of a device cannot be adequately predicted from the junction-to-ambient thermal
resistance. The thermal performance of any component is strongly dependent on the power dissipation of
surrounding components. In addition, the ambient temperature varies widely within the application. For
many natural convection and especially closed box applications, the board temperature at the perimeter
(edge) of the package is approximately the same as the local air temperature near the device. Specifying
the local ambient conditions explicitly as the board temperature provides a more precise description of the
local ambient conditions that determine the temperature of the device.
At a known board temperature, the junction temperature is estimated using the following equation:
where:
When the heat loss from the package case to the air can be ignored, acceptable predictions of junction
temperature can be made. The application board should be similar to the thermal test condition: the
component is soldered to a board with internal planes.
23.1.4
To determine the junction temperature of the device in the application after prototypes are available, the
thermal characterization parameter (
measurement of the temperature at the top center of the package case using the following equation:
where:
66
MPC8306 PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 2
T
R
P
T
T
R
P
T
A
J
B
J

D

D
JA
JB
= junction temperature (C)
= junction temperature (C)
= ambient temperature for the package (C)
= board temperature at the package perimeter (C)
= power dissipation in the package (W)
= power dissipation in package (W)
Estimation of Junction Temperature with Junction-to-Board
Thermal Resistance
Experimental Determination of Junction Temperature
= junction-to-ambient thermal resistance (C/W)
= junction-to-board thermal resistance (C/W) per JESD51-8
JT
T
T
J
) can be used to determine the junction temperature with a
J
= T
= T
B
T
+ (R  J
+ (

JT
B


P
P
D
D
)
)
J
– T
A
) are possible.
Freescale Semiconductor
Eqn. 2
Eqn. 3