P5010NXN1QMB Freescale Semiconductor, P5010NXN1QMB Datasheet - Page 67

• Manufacturer Part Number: P5010NXN1QMB
• Description: Processors - Application Specialized P5010 Ext Tmp NoEnc 1600/1200 r2.0
• Manufacturer: Freescale Semiconductor

Specifications of P5010NXN1QMB

• Rohs: yes

2.6
This section discusses the system clock timing specifications for DC and AC power, spread spectrum sources, real time clock
timing, and dTSEC gigabit Ethernet reference clocks AC timing.
2.6.1
This table provides the system clock (SYSCLK) DC specifications.
Freescale Semiconductor
For recommended operating conditions, see
Junction to board
Junction to case top
Junction to lid top
Note:
Input high voltage
Input low voltage
Input capacitance
Input current (OV
Note:
1. The min V
2. The symbol OV
1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)
2. Per JEDEC JESD51–3 and JESD51-6 with the board (JESD51–9) horizontal.
3. Thermal resistance between the die and the printed-circuit board per JEDEC JESD51–8. Board temperature is measured
4. Junction-to-case-top at the top of the package determined using MIL-STD 883 Method 1012.1. The cold plate temperature
5. Junction-to-lid-top thermal resistance determined using the using MIL-STD 883 Method 1012.1. However, instead of the
6. Reference
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal
resistance.
on the top surface of the board near the package.
is used for the case temperature. Reported value includes the thermal resistance of the interface layer.
cold plate, the lid top temperature is used here for the reference case temperature. Reported value does not include the
thermal resistance of the interface layer between the package and cold plate.
Conditions.”
Input Clocks
System Clock (SYSCLK) Timing Specifications
IL
Parameter
Section 3.8, “Thermal Management
and max V
IN
= 0 V or OV
IN
, in this case, represents the OV
Rating
P5020/P5010 QorIQ Integrated Processor Hardware Specifications, Rev. 0
Table 13. SYSCLK DC Electrical Characteristics (OV
IH
values are based on the respective min and max OV
Table 12. Package Thermal Characteristics (continued)
IN
= OV
DD)
Table
3.
Symbol
V
C
V
I
IN
IH
IL
IN
Information,” for additional details.
IN
symbol referenced in
Board
Min
—
—
—
2.0
—
—
—
Section 2.1.2, “Recommended Operating
Typical
IN
—
—
—
—
Symbol
R
R
R
values found in
ΘJCtop
ΘJClid
ΘJB
DD
= 3.3 V)
6
Value
0.44
0.17
Max
±40
3
0.8
15
—
Electrical Characteristics
Table
3.
°
°
°
Unit
C/W
C/W
C/W
Unit
μA
pf
V
V
Note
3
4
5
Note
—
1
1
2
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