MCIMX6S1AVM08ABR Freescale Semiconductor, MCIMX6S1AVM08ABR Datasheet - Page 23

• Manufacturer Part Number: MCIMX6S1AVM08ABR
• Description: Processors - Application Specialized i.MX6 Solo rev 1.1
• Manufacturer: Freescale Semiconductor
• Type: Multimedia Applicationsr

Specifications of MCIMX6S1AVM08ABR

• Rohs: yes
• Core: ARM Cortex A9
• Processor Series: i.MX6
• Data Bus Width: 32 bit
• Maximum Clock Frequency: 800 MHz
• Data Ram Size: 16 KB
• Operating Supply Voltage: 1.175 V to 1.5 V
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• Package / Case: MAPBGA-624
• Interface Type: Parallel
• Memory Type: L1/L2 Cache, ROM, SRAM
• Minimum Operating Temperature: - 40 C
• Number Of Timers: 2

1
4.1.2
4.1.2.1
Table 8
Freescale Semiconductor
ESD damage immunity:
Storage temperature range
• Human Body Model (HBM)
• Charge Device Model (CDM)
OVDD is the I/O supply voltage.
1
2
3
4
5
6
Junction to Ambient
Junction to Ambient
Junction to Board
Junction to Case
Junction to Package Top
Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site
(board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and board
thermal resistance.
Per JEDEC JESD51-2 with the single layer board horizontal. Thermal test board meets JEDEC specification for the
specified package.
Per JEDEC JESD51-6 with the board horizontal.
Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is
measured on the top surface of the board near the package.
Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883
Method 1012.1).
Thermal characterization parameter indicating the temperature difference between package top and the junction
temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is
written as Psi-JT.
displays the thermal resistance data.
Thermal Resistance
Parameter Description
BGA Case 2240 Package Thermal Resistance
Rating
i.MX 6Solo/6DualLite Automotive and Infotainment Applications Processors, Rev. 1
1,5
1,4
1
1
1,6
Single-layer board (1s); natural convection
Four-layer board (2s2p); natural convection
Single-layer board (1s); airflow 200 ft/min
Four-layer board (2s2p); airflow 200 ft/min
Natural Convection
Table 7. Absolute Maximum Ratings (continued)
Table 8. Thermal Resistance Data
Test Conditions
T
Symbol
STORAGE
V
esd
2,3
2,3
2
2
R
R
R
R
R
R
Ψ
θJA
θJA
θJA
θJA
θJB
θJC
JT
Symbol
Min
-40
—
—
Electrical Characteristics
38
23
30
20
14
6
2
Value
2000
Max
500
150
o
o
o
o
o
o
o
C/W
C/W
C/W
C/W
C/W
C/W
C/W
Unit
Unit
o
V
C
23