MPC8544DS Freescale Semiconductor, MPC8544DS Datasheet - Page 82
MPC8544DS
Manufacturer Part Number
MPC8544DS
Description
BOARD DEVELOPMENT SYSTEM 8544
Manufacturer
Freescale Semiconductor
Series
PowerQUICC III™r
Type
MPUr
Datasheets
1.MPC8544VTALF.pdf
(117 pages)
2.MPC8544VTALF.pdf
(2 pages)
3.MPC8544VTALF.pdf
(1340 pages)
4.MPC8544DS.pdf
(2 pages)
Specifications of MPC8544DS
Contents
Board
Processor To Be Evaluated
MPC8544E
Data Bus Width
32 bit
Interface Type
Ethernet, I2C
Operating Supply Voltage
- 0.3 V to + 1.1 V
Leaded Process Compatible
Yes
Peak Reflow Compatible (260 C)
Yes
Rohs Compliant
Yes
For Use With/related Products
MPC8544
For Use With
PPC8544EVTANG - EVAL MPC8544 783FCPBGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
- MPC8544VTALF PDF datasheet
- MPC8544VTALF PDF datasheet #2
- MPC8544VTALF PDF datasheet #3
- MPC8544DS PDF datasheet #4
- Current page: 82 of 117
- Download datasheet (2Mb)
Package Description
18.2
Figure 59
783 FC-PBGA package without a lid.
82
Notes:
1. All dimensions are in millimeters.
2. Dimensions and tolerances per ASME Y14.5M-1994.
3. Maximum solder ball diameter measured parallel to datum A.
4. Datum A, the seating plane, is determined by the spherical crowns of the solder balls.
5. Parallelism measurement shall exclude any effect of mark on top surface of package.
6. Capacitors may not be present on all parts. Care must be taken not to short exposed metal capacitor pads.
7. All dimensions are symmetric across the package center lines, unless dimensioned otherwise.
Mechanical Dimensions of the MPC8544E FC-PBGA
shows the mechanical dimensions and bottom surface nomenclature of the MPC8544E,
MPC8544E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 5
Figure 59. Mechanical Dimensions and Bottom Surface Nomenclature
of the MPC8544E FC-PBGA without a Lid
Freescale Semiconductor
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