MC68332ACAG16 Freescale Semiconductor, MC68332ACAG16 Datasheet - Page 41

• Manufacturer Part Number: MC68332ACAG16
• Description: IC MCU 32BIT 16MHZ 144-LQFP
• Manufacturer: Freescale Semiconductor
• Series: M683xxr

Specifications of MC68332ACAG16

• Core Processor: CPU32
• Core Size: 32-Bit
• Speed: 16MHz
• Connectivity: EBI/EMI, SCI, SPI, UART/USART
• Peripherals: POR, PWM, WDT
• Number Of I /o: 15
• Program Memory Type: ROMless
• Ram Size: 2K x 8
• Voltage - Supply (vcc/vdd): 4.5 V ~ 5.5 V
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 144-LQFP
• Processor Series: M683xx
• Core: CPU32
• Data Bus Width: 32 bit
• Maximum Clock Frequency: 16 MHz
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Interface Type: SCI, SPI, UART
• Minimum Operating Temperature: - 40 C
• Controller Family/series: 68K
• No. Of I/o's: 15
• Ram Memory Size: 2KB
• Cpu Speed: 16MHz
• No. Of Timers: 1
• Embedded Interface Type: QSPI, SCI, UART
• Digital Ic Case Style: LQFP
• Rohs Compliant: Yes
• Data Ram Size: 2 KB
• Number Of Programmable I/os: 15
• Number Of Timers: 16
• Cpu Family: 68K/M683xx
• Device Core: ColdFire
• Device Core Size: 32b
• Frequency (max): 16MHz
• Program Memory Size: Not Required
• Total Internal Ram Size: 2KB
• # I/os (max): 15
• Number Of Timers - General Purpose: 16
• Operating Supply Voltage (typ): 5V
• Operating Supply Voltage (max): 5.5V
• Operating Supply Voltage (min): 4.5V
• Instruction Set Architecture: RISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 144
• Package Type: LQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -
• Data Converters: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

4.1 General
MC68332
USER’S MANUAL
This section is an overview of SIM function. Refer to the SIM Reference Manual (SIM-
RM/AD) for a comprehensive discussion of SIM capabilities. Refer to APPENDIX D
REGISTER SUMMARY for information concerning the SIM address map and register
structure.
The system integration module (SIM) consists of five functional blocks. Figure 4-1 is
a block diagram of the SIM.
The system configuration and protection block controls configuration parameters and
provides bus and software watchdog monitors. In addition, it provides a periodic inter-
rupt generator to support execution of time-critical control routines.
The system clock generates clock signals used by the SIM, other IMB modules, and
external devices.
The external bus interface handles the transfer of information between IMB modules
and external address space. EBI pins can also be configured for use as general-pur-
pose I/O ports E and F.
The chip-select block provides 12 chip-select signals. Each chip-select signal has an
associated base register and option register that contain the programmable character-
istics of that chip select. Chip-select pins can also be configured for use as general-
purpose output port C.
The system test block incorporates hardware necessary for testing the MCU. It is used
to perform factory tests, and its use in normal applications is not supported.
SECTION 4 SYSTEM INTEGRATION MODULE
Freescale Semiconductor, Inc.
For More Information On This Product,
SYSTEM INTEGRATION MODULE
Go to: www.freescale.com
4-1