ST7FLITEU09M6TR STMicroelectronics, ST7FLITEU09M6TR Datasheet - Page 121

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ST7FLITEU09M6TR

Manufacturer Part Number
ST7FLITEU09M6TR
Description
MCU 8BIT SGL VOLT FLASH SO-8
Manufacturer
STMicroelectronics
Series
ST7r
Datasheet

Specifications of ST7FLITEU09M6TR

Core Processor
ST7
Core Size
8-Bit
Speed
8MHz
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
5
Program Memory Size
2KB (2K x 8)
Program Memory Type
FLASH
Eeprom Size
128 x 8
Ram Size
128 x 8
Voltage - Supply (vcc/vdd)
2.4 V ~ 5.5 V
Data Converters
A/D 5x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
8-SOIC (3.9mm Width)
Processor Series
ST7FLITEUx
Core
ST7
Data Bus Width
8 bit
Data Ram Size
128 B
Interface Type
ICC
Maximum Clock Frequency
8 MHz
Number Of Programmable I/os
5
Number Of Timers
2
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Development Tools By Supplier
ST7FLITE-SK/RAIS, ST7FLITU0-D/RAIS, STX-RLINK
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 5 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Connectivity
-
Lead Free Status / Rohs Status
No

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
ST7FLITEU09M6TR
Manufacturer:
MICROCHIP
Quantity:
12 000
ST7LITEU05 ST7LITEU09
14
14.1
Package characteristics
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a Lead-free second level interconnect. The category of
second Level Interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label.
ECOPACK is an ST trademark. ECOPACK® specifications are available at: www.st.com.
Package mechanical data
Figure 70. 8-lead very thin fine pitch dual flat no-lead package, package outline
INDEX AREA
(D/2 x E/2)
INDEX AREA
(D/2 x E/2)
A
TOP VIEW
SIDE VIEW
BOTTOM VIEW
D2
D
e
b
E
L
E2
Package characteristics
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