HD6417750RF240DV Renesas Electronics America, HD6417750RF240DV Datasheet - Page 567

MPU 3V 16K I-TEMP,PB-FREE 208-QF

HD6417750RF240DV

Manufacturer Part Number
HD6417750RF240DV
Description
MPU 3V 16K I-TEMP,PB-FREE 208-QF
Manufacturer
Renesas Electronics America
Series
SuperH® SH7750r
Datasheet

Specifications of HD6417750RF240DV

Core Processor
SH-4
Core Size
32-Bit
Speed
240MHz
Connectivity
EBI/EMI, FIFO, SCI, SmartCard
Peripherals
DMA, POR, WDT
Number Of I /o
28
Program Memory Type
ROMless
Ram Size
48K x 8
Voltage - Supply (vcc/vdd)
1.4 V ~ 1.6 V
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
208-QFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
Data Converters
-

Available stocks

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Price
Part Number:
HD6417750RF240DV
Manufacturer:
HITACHI
Quantity:
7 287
Pipelined Access: When the RASD bit is set to 1 in MCR, pipelined access is performed between
an access by the CPU and an access by the DMAC, or in the case of consecutive accesses by the
DMAC, to provide faster access to synchronous DRAM. As synchronous DRAM is internally
divided into two or four banks, after a READ or WRIT command is issued for one bank it is
possible to issue a PRE, ACTV, or other command during the CAS latency cycle or data latch
cycle, or during the data write cycle, and so shorten the access cycle.
CKIO
Bank
Precharge-sel
Address
CSn
RD/WR
RAS
CASS
DQMn
D63–D0
(read)
BS
CKE
DACKn
(SA: IO → memory)
Note: For DACKn, an example is shown where CHCRn.AL (access level) = 0 for the DMAC.
Figure 13.37 Burst Write Timing (Different Row Addresses)
Tpr
Row
H/L
Tpc
Tr
Row
Row
Row
Trw
Tc1
c1
Tc2
Rev.7.00 Oct. 10, 2008 Page 481 of 1074
c2
Section 13 Bus State Controller (BSC)
H/L
c1
Tc3
c3
Tc4
c4
Trwl
REJ09B0366-0700
Trwl
Trwl

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