th58nvg1s3aft05 TOSHIBA Semiconductor CORPORATION, th58nvg1s3aft05 Datasheet

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th58nvg1s3aft05

Manufacturer Part Number
th58nvg1s3aft05
Description
2gbit 256m U 8bits Cmos Nand E2 Prom
Manufacturer
TOSHIBA Semiconductor CORPORATION
Datasheet

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TENTATIVE
2GBIT (256M u 8BITS) CMOS NAND E
DESCRIPTION
FEATURES
x Organization
x Modes
x Mode control
PIN ASSIGNMENT
x TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general
x The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal
can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer,
when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid
situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to
property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most
recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling Guide for
Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc..
equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are
neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or
failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control
instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,
medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this document shall be made at
the customer’s own risk.
Programmable Read-Only Memory (NAND E
The device has a 2112-byte static registers which allow program and read data to be transferred
between the register and the memory cell array in 2112-byte increments. The Erase operation is
implemented in a single block unit (128 Kbytes + 4Kbytes: 2112 bytes x 64 pages).
input / output as well as for command inputs. The Erase and Program operations are automatically
executed making the device most suitable for applications such as solid-state file storage, voice
recording, image file memory for still cameras and other systems which require high-density non-
volatile memory data storage.
RY
GND
The TH58NVG1S3A is a single 3.3-V 2G-bit (2,214,592,512 bits) NAND Electrically Erasable and
The TH58NVG1S3A is a serial-type memory device which utilizes the I/O pins for both address and data
CLE
ALE
/
WE
WP
CE
V
NC
NC
NC
NC
NC
RE
NC
NC
V
NC
NC
NC
NC
NC
NC
NC
Memory cell allay 2112 u 64K u 8 u 2
Register
Page size
Block size
ReadØResetØAuto Page Program
Auto Block EraseØStatus Read
Serial inputÛoutput
Command control
BY
CC
SS
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
TOSHIBA MOS DIGITAL INTEGRATED CIRCUIT SILICON GATE CMOS
2112 u 8
2112bytes
(128K  4K) bytes
(TOP VIEW)
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
NC
NC
NC
NC
I/O8
I/O7
I/O6
I/O5
NC
NC
NC
V
V
NC
NC
NC
I/O4
I/O3
I/O2
I/O1
NC
NC
NC
NC
CC
SS
2
PROM) organized as (2048+64) bytes x 64 pages x 2048 blocks.
2
PROM
x Powersupply
x Program/Erase Cycles
x Access time
x Operating current
x Package
PIN NAMES
Cell array to register
Serial Read Cycle
Read (50 ns cycle)
Program (avg.)
Erase (avg.)
TSOP I 48-P-1220-0.50
Standby
(Weight : 0.53 g typ.)
I/O1 to I/O8
RY
GND
CLE
ALE
V
V
WE
RE
WP
CE
CC
SS
/
BY
I/O port
Chip enable
Write enable
Read enable
Command latch enable
Address latch enable
Write protect
Ready / Busy
Ground Input
Power supply
Ground
V
25 Psmax
10 mA typ.
10 mA typ.
10 mA typ.
50 PA max
50 ns min
TH58NVG1S3AFT05
1E5 Cycles(With ECC)
CC
2003-05-19A
2.7 V to 3.6 V
000707EBA1
1/32

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th58nvg1s3aft05 Summary of contents

Page 1

... ALE Address latch enable Write protect Ready / Busy I/O4 I/O3 GND Ground Input I/O2 I/O1 V Power supply Ground TH58NVG1S3AFT05 1E5 Cycles(With ECC) 25 Psmax 50 ns min 10 mA typ typ typ max 000707EBA1 2003-05-19A 1/32 ...

Page 2

... Control circuit HV generator VALUE  0.6 to 4.6  0.6 to 4 ½ 0.3 260 -55 to 150 CONDITION MIN OUT TH58NVG1S3AFT05 Column buffer Column decoder Data register Sense amp Memory cell array UNIT °C °C °C MAX UNIT 20 pF ...

Page 3

... OUT mA OUT cycle   0V/VCC 0 0V/VCC CC , Vcc 400 Vcc pin V 0 TH58NVG1S3AFT05 TYP. MAX UNIT - 2048 Blocks TYP. MAX UNIT 3 0.8 V MIN TYP. MAX UNIT ...

Page 4

... CLSTO t RE High to WE Low RHW t WE High to CE Low WHC t WE High to RE Low WHR t Memory Cell Array to Starting Address High to Busy WB t Device Reset Time (Read/Program/Erase) RST PARAMETER TH58NVG1S3AFT05 MIN MAX UNIT NOTES ...

Page 5

... CC SYMBOL PARAMETER t Average Programming Time PROG Number of Programming Cycles on Same Page N (per 512+16 bytes) t Block Erasing Time BERASE (1) Refer to Application Note (12) toward the end of this document. TH58NVG1S3AFT05 CONDITION 2.4 V, 0.4 V 3ns 1.5 V, 1.5 V 1 (100 pF TTL L MIN TYP. MAX UNIT NOTES ...

Page 6

... TIMING DIAGRAMS Latch Timing Diagram for Command/Address /Data CLE ALE I/O Command Input Cycle Timing Diagram CLE t CLS ALS ALE t DS I/O Setup Time Hold Time CLH ALH t DH TH58NVG1S3AFT05 : 2003-05-19A 6/32 ...

Page 7

... CA8 to11 PA0 TH58NVG1S3AFT05 ALH PA8 to 15 PA16 : CLH ...

Page 8

... REH RHZ REA RHZ t CLSTO t CLH WHC CSTO t WHR TH58NVG1S3AFT05 t CEA CHZ REA RHZ t CHZ RSTO t RHZ Status output : 2003-05-19A 8/32 ...

Page 9

... PA0 to 7 PA8 to 15 PA16 CA8 CLS ALH ALS PA0 to 7 PA8 to 15 PA16 TH58NVG1S3AFT05 t CLEA t CLS CLH CEA REA D OUT 30H N Data out from Col ...

Page 10

... ALS t ALH PA0 to PA8 to 30H PA16 Page address P TH58NVG1S3AFT05 t CLEA CLH CEA REA OUT OUT Page address P Column address A 1 Continues next page ...

Page 11

... CLH ALS ALH ALS CA0 to CA8 to E0H 7 11 Column address B Column address TH58NVG1S3AFT05 t CLEA CEA REA D D OUT OUT OUT N’ Page address P B 2003-05-19A 11/32 ...

Page 12

... I/O CA0 to CA8 to PA0 to 80H ALH t ALS PA8 PA16 not input data while data is being output TH58NVG1S3AFT05 t Prog Status 10H 70H output D 2111* IN 2003-05-19A 12/32 ...

Page 13

... ALE I/O PA8 to PA0 to 60H 15 7 Auto Block Erase Setup command : ALH BERASE PA16 D0H Busy Erase Start command : Do not input data while data is being output. TH58NVG1S3AFT05 Status 70H output Status Read command 2003-05-19A 13/32 ...

Page 14

... ALS t ALEA ALE RE tDH tDH t REAID 90H 00H I/O ID Read Address command 00 t CEA REAID REAID REAID 98H DAH Note1 Maker code Device code Note1 : 81H or 01H Note2 : 95H or 15H Note3 : 44H or C4H TH58NVG1S3AFT05 t REAID Note2 Note3 : 2003-05-19A 14/32 ...

Page 15

... Busy state ( during the Program, Erase and Read operations and will return to Ready state ( after completion of the operation. The output buffer for this signal is an open drain and has to be pulled-up to Vccq with appropriate resister.. TH58NVG1S3AFT05 ...

Page 16

... PA9 PA8 PA16 CLE ALE TH58NVG1S3AFT05 CA0 to CA11 : Column address PA0 to PA16 : Page address PA6 to PA16 : Block address PA0 to PA5 : NAND address in block * V/Vcc * * 2003-05-19A 16/32 ...

Page 17

... First Cycle Second Cycle I/ TH58NVG1S3AFT05 Acceptable while Busy Ó Ó I/O1 to I/O8 Power Data output Active High impedance Active High impedance Standby High Impedance Active 2003-05-19A 17/32 ...

Page 18

... In the serial data out from the register, the column address can be changed by inputting the column address with 05h and E0h commands. The data are read out in serial from the column address which Cell array is input to the device by 05h and E0h commands with /RE clock. TH58NVG1S3AFT05 M+1 M+2 M Page Address N E0H M’ ...

Page 19

... If the programming does not succeed, the Program/Verify operation is repeated by the device until success is achieved or until the maximum loop number set in the device is reached. after the Erase Start command “DOH” Status Read command Busy TH58NVG1S3AFT05 Status 70h Out Pass I/O Fail 2003-05-19A 19/32 ...

Page 20

... Descripton I/O8 I/O7 I/ level cell 4 level cell 8 level cell 16 level cell TH58NVG1S3AFT05 Note2 Note3 Note1 : 81H or 01H Note2 : 95H or 15H Note3 : 44H or C4H I/O2 I/O1 Hex Data 98H DAH 81H or 01H ...

Page 21

... Reserved Reserved X8 0 X16 Descripton I/O8 I/O7 I/ 64Mb 0 0 128Mb 0 0 256Mb 0 1 512Mb 0 1 1Gb 1 0 2Gb 1 0 4Gb 1 1 8Gb TH58NVG1S3AFT05 I/O5 I/O4 I/O3 I/O2 I/ I/O5 I/O4 I/O3 I/O2 I/ ...

Page 22

... Ready state. Busy: 0 Busy: 0 Not Protected Device 2 3 Busy 70H Status on Device N pin signals from multiple devices are wired together as shown in the TH58NVG1S3AFT05 The Pass/Fail status on I/O1 and I/ Device Device 2003-05-19A 22/32 ...

Page 23

... BY The second FF t (max RST Figure (max 500 P s) RST Figure 9. FF Figure 10. t (max RST 70 ( command is invalid, but the third FF Figure 12. TH58NVG1S3AFT05 I/O status : Pass/Fail o Pass : Ready/Busy o Ready (2) ( command is valid. 2003-05-19A 23/32 ...

Page 24

... Stored data may be corrupted if an unknown command is entered during the command cycle. (4) Restriction of command while Busy state During Busy state, do not input any command except 70H, and FFH 1ms max Operation Figure 15. Power-on/off Sequence FF Reset Figure 16. TH58NVG1S3AFT05 don’t care V IL don’t care 2003-05-19A 24/32 ...

Page 25

... Page 0 (1) Page 1 (2) Page 2 (3) Page 31 (32) Page 63 (64 Mode specified by the command. Ex.) Random page program (Prohibition) DATA IN: Data (1) Page 0 Page 1 Page 2 Page 31 Page 63 Figure 17. page programming within a block TH58NVG1S3AFT05 Programming cannot be executed. Data (64) Data register (2) (32) (3) (1) (64) 2003-05-19A 25/32 ...

Page 26

... Ready 1.0 V Busy Figure 20. TH58NVG1S3AFT05 00 [A] Status output Status Read 80 10 Address Data N input / BY buffer consists of an open drain 3 25° 100 ...

Page 27

... The Erase and Program operations are automatically reset when WP goes Low. The operations are enabled and disabled as follows: Enable Programming WE DIN (100 ns MIN) WW Disable Programming WE DIN (100 ns MIN) WW Enable Erasing WE 60 DIN (100 ns MIN) WW Disable Erasing WE DIN (100 ns MIN) WW TH58NVG1S3AFT05 2003-05-19A 27/32 ...

Page 28

... When six address cycles are input Although the device may read in sixth address ignored inside the chip. Read operation CLE CE WE ALE I/O 00H Program operation CLE CE WE ALE 80H I/O Address input ignored Address input Figure 22. ignored Figure 23. TH58NVG1S3AFT05 30H Data input 2003-05-19A 28/32 ...

Page 29

... Note: The input data for unprogrammed or previously programmed page segments must be "1" (i.e. the inputs for all page bytes outside the segment which programmed should be set to all “1”). : 512 bytes x 4 segments All 1s Data Pattern 2 All 1s All 1s Data Pattern 2 Figure 24. TH58NVG1S3AFT05 Data Pattern 8 Data Pattern 8 2003-05-19A 29/32 ...

Page 30

... Bad Block *1 Block No. 2048 Yes End ç ç ç ç ç ç ç Figure 27. TH58NVG1S3AFT05 TYP. MAX UNIT - 2048 Block of each block. If the column address 0 or 2048 of the 1st page or the 2nd page is not FF (Hex), define the block as a bad block. ...

Page 31

... DETECTION AND COUNTERMEASURE SEQUENIE When an error happens in Block A, try to reprogram the data into another Block (Block B) by loading from an external buffer. Then, Block A prevent further system accesses to Block creating a bad block table or by using another appropriate scheme). Block B Figure 28. TH58NVG1S3AFT05 2003-05-19A 31/32 ...

Page 32

... Package Dimensions Weight: 0.53 g (typ.) TH58NVG1S3AFT05 2003-05-19A 32/32 ...

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