DAC1408D650C1 NXP [NXP Semiconductors], DAC1408D650C1 Datasheet - Page 2

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DAC1408D650C1

Manufacturer Part Number
DAC1408D650C1
Description
Dual 14-bit DAC up to 650 Msps 2, 4 or 8 interpolating
Manufacturer
NXP [NXP Semiconductors]
Datasheet
NXP Semiconductors
3. Applications
4. Ordering information
Table 1.
DAC1408D650
Preliminary data sheet
Type number
DAC1408D650HN/C1
Ordering information
Package
Name
HVQFN64
Two’s complement or binary offset data
format
LMF = 421 or LMF = 211 support
Differential CML receiver with
embedded termination
Synchronization of multiple DAC
devices outputs
Wireless infrastructure: LTE, WiMAX, GSM, CDMA, WCDMA, TD-SCDMA
Communication: LMDS/MMDS, point to point
Direct Digital Synthesis (DDS)
Broadband wireless systems
Digital radio links
Instrumentation
Automated Test Equipment (ATE)
DAC1408D; up to 650 Msps; 2×, 4× or 8× interpolating with JESD204A
Description
plastic thermal enhanced very thin quad flat package; no leads;
64 terminals; body 9 × 9 × 0.85 mm; exposed die pad
All information provided in this document is subject to legal disclaimers.
Rev. 02 — 11 August 2010
Fully compatible SPI port
Industrial temperature range from
−40 °C to +85 °C
Integrated PLL can be bypassed
Embedded complex modulator
DAC1408D650
© NXP B.V. 2010. All rights reserved.
Version
SOT804-3
2 of 98

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