ADSP-21363SBBC-ENG AD [Analog Devices], ADSP-21363SBBC-ENG Datasheet - Page 37

• Manufacturer Part Number: ADSP-21363SBBC-ENG
• Description: SHARC Processor
• Manufacturer: AD [Analog Devices]

Preliminary Technical Data
THERMAL CHARACTERISTICS
The ADSP-21363 processor is rated for performance to a maxi-
mum junction temperature of 125°C.
Table 33
JEDEC standards JESD51-2 and JESD51-6 and the junction-to-
board measurement complies with JESD51-8. Test board and
thermal via design comply with JEDEC standards JESD51-9
(Mini-BGA) and JESD51-5 (Integrated Heatsink LQFP). The
junction-to-case measurement complies with MIL- STD-883.
All measurements use a 2S2P JEDEC test board.
Industrial applications using the Mini-BGA package require
thermal vias, to an embedded ground plane, in the PCB. Refer to
JEDEC Standard JESD51-9 for printed circuit board thermal
ball land and thermal via design information. Industrial applica-
tions using the LQFP package require thermal trace squares and
thermal vias, to an embedded ground plane, in the PCB. The
bottom side heat slug must be soldered to the thermal trace
squares. Refer to JEDEC Standard JESD51-5 for more
information.
To determine the Junction Temperature of the device while on
the application PCB, use:
where:
T
T
the package
Ψ
is the Typical value from
P
D
J
CASE
JT
= Junction temperature ×C
= Power dissipation (see EE Note #TBD)
= Junction-to-Top (of package) characterization parameter
Figure 33. Typical Output Delay or Hold vs. Load Capacitance
= Case temperature (×C) measured at the top center of
10
-4
-2
8
4
2
0
6
through
0
Y = 0.0488X - 1.5923
Table 36
T
J
(at Ambient Temperature)
=
50
T
Table 33
CASE
airflow measurements comply with
LOAD CAPACITANCE (pF)
+
100
(
through
Ψ
JT
×
P
D
Table
)
150
Rev. PrA | Page 37 of 44 | September 2004
36.
200
Values of θ
design considerations. θ
mation of T
where:
T
Values of θ
design considerations when an external heatsink is required.
Values of θ
design considerations. Note that the thermal characteristics val-
ues provided in tables 33 through 36 are modeled values.
Table 33. Thermal Characteristics for 136 Ball Mini-BGA
(No thermal vias in PCB)
Table 34. Thermal Characteristics for 136 Ball Mini- BGA
(Thermal vias in PCB)
Table 35. Thermal Characteristics for 144-Lead Integrated
Heatsink (INT–HS) LQFP (With heat slug not soldered to
PCB)
Parameter
θ
θ
θ
θ
Ψ
Ψ
Ψ
Parameter
θ
θ
θ
θ
Ψ
Ψ
Ψ
Parameter
θ
θ
θ
θ
Ψ
Ψ
Ψ
A
JA
JMA
JMA
JC
JA
JMA
JMA
JC
JA
JMA
JMA
JC
JT
JMT
JMT
JT
JMT
JMT
JT
JMT
JMT
= Ambient Temperature
JA
JC
JB
J
by the equation:
are provided for package comparison and PCB
are provided for package comparison and PCB
are provided for package comparison and PCB
Condition
Airflow = 0 m/s
Airflow = 1 m/s
Airflow = 2 m/s
Airflow = 0 m/s
Airflow = 1 m/s
Airflow = 2 m/s
Condition
Airflow = 0 m/s
Airflow = 1 m/s
Airflow = 2 m/s
Airflow = 0 m/s
Airflow = 1 m/s
Airflow = 2 m/s
Condition
Airflow = 0 m/s
Airflow = 1 m/s
Airflow = 2 m/s
Airflow = 0 m/s
Airflow = 1 m/s
Airflow = 2 m/s
T
J
=
JA
T
can be used for a first order approxi-
A
0
C
+
(
θ
JA
×
P
D
Typical
25.20
21.70
20.80
5.00
0.140
0.330
0.410
Typical
22.50
19.30
18.40
5.00
0.130
0.300
0.360
Typical
26.08
24.59
23.77
6.83
0.236
0.427
0.441
)
ADSP-21363
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W